Main Title |
Carbon-black dispersion preplating technology for printed wire board manufacturing : final technology evaluation report / |
Author |
Folsom, D. W. ;
Gavaskar, A. R. ;
Jones, J. A. ;
Olfenbuttel, R. F.
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Other Authors |
|
CORP Author |
Battelle, Columbus, OH.;Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab. |
Publisher |
U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory, |
Year Published |
1993 |
Report Number |
EPA 600/R-93/201.; EPA-68-C0-0003 |
Stock Number |
PB94-114790 |
Subjects |
Protective coatings ;
Copper plating
|
Additional Subjects |
Metal finishing ;
Printed circuits ;
Electroplating ;
Manufacturing ;
Pollution control ;
Breadboard models ;
Metal cleaning ;
Reduction ;
Sources ;
Pollution abatement ;
Recycling ;
Carbon black ;
Copper coatings ;
Operations ;
Cost engineering ;
Economic analysis ;
Chemical compounds ;
Dispersion ;
Waste minimization
|
Internet Access |
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Holdings |
Library |
Call Number |
Additional Info |
Location |
Last Modified |
Checkout Status |
NTIS |
PB94-114790 |
Some EPA libraries have a fiche copy filed under the call number shown. |
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07/26/2022 |
|
Collation |
1 volume |
Abstract |
The project compared chemical use, waste generation, cost, and product quality between electroless copper and carbon-black-based preplating technologies at the printed wire board (PWB) manufacturing facility of McCurdy Circuits in Orange, CA. The carbon-black based preplating technology evaluated is used as an alternative process for electroless copper (EC) plating of through-holes before electrolytic copper plating. The specific process used at McCurdy is the BlackHole (BH) technology process, which uses a dispersion of carbon black in an aqueous solution to provide a conductive surface for subsequent electrolytic copper plating. The carbon-black dispersion technology provided effective waste reduction and long-term cost savings. The economic analysis determined that the new process was cost efficient because chemical use was reduced and the process proved more efficient; the payback period was less than 4 yrs. |
Notes |
Microfiche. |