Record Display for the EPA National Library Catalog


OLS Field Name OLS Field Data
Main Title Waste minimization assessment for multilayered printed circuit board manufacturing /
Author Kirsch, F. William. ; Looby., G. P.
Other Authors
Author Title of a Work
Looby, Gwen P.
CORP Author University City Science Center, Philadelphia, PA.;Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab.
Publisher U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory,
Year Published 1991
Report Number EPA/600-M-91-021; EPA-R-814903
Stock Number PB91-234534
OCLC Number 24997332
Subjects Waste minimization--Research--Colorado. ; Printed circuits--Research--Colorado. ; Printed circuits industry--Environmental aspects--Colorado.
Additional Subjects Hazardous materials ; Waste management ; Pollution abatement ; Circuit boards ; Laminates ; Industrial wastes ; Assessments ; Liquid wastes ; Cleaning ; Waste recycling ; Sulfuric acid ; Soldering alloys ; Waste minimization ; Electroless plating ; Source reduction ; SIC 20-39
Internet Access
Description Access URL
Library Call Number Additional Info Location Last
EHAM  TD793.9.K574 1991 Region 1 Library/Boston,MA 04/29/2016
EJBD ARCHIVE EPA 600-M-91-021 In Binder Headquarters Library/Washington,DC 02/15/2017
EJBD  EPA 600-M-91-021 Headquarters Library/Washington,DC 04/08/2013
EJED  EPA 600/M-91-021 OCSPP Chemical Library/Washington,DC 05/07/1999
ELBD RPS EPA 600-M-91-021 repository copy AWBERC Library/Cincinnati,OH 10/17/2014
NTIS  PB91-234534 Most EPA libraries have a fiche copy filed under the call number shown. Check with individual libraries about paper copy. 01/01/1988
Collation 6 pages : illustrations ; 28 cm.
The U.S. Environmental Protection Agency (EPA) has funded a pilot project to assist small- and medium-size manufacturers who want to minimize their generation of hazardous waste but who lack the expertise to do so. Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual (EPA/625/7-88/003, July 1988). The WMAC team at Colorado State University inspected a plant manufacturing multilayered circuit boards. This complex operation has seven key elements: preparing individual layers of boards; transferring circuit patterns to these layers and forming copper oxide castings; bonding to form multiple layers; applying copper (electroless plating) to ensure electrical contact; applying photoresist to define the area on which copper circuits are to be plated; applying copper electrolytically to establish circuit patterns on outer board surfaces followed by tin or tin/lead plating to protect the circuits; and applying solder and final cleanup after selectively removing protective tin layers. All these elements of the manufacturing process generate hazardous waste, e.g., electrolytic application of copper generates sulfuric acid; propylene glycol methyl ether; copper-laden deionized water and rinse water; ethoxylated octylphenol; copper-free drag-out-laden water; and copper sulfate. The plant had already instituted waste minimization techniques; the team's report, detailing findings and recommendations, indicated that additional reductions and savings, although not as great, were still possible. The greatest reduction would come from separating liquid wastes into four streams containing differing amounts of waste. Copper-containing streams could be further treated and reused in process rinses and baths. Spent process solutions could be stored for recycling and reclaiming. The Research Brief was developed by the principal investigators and EPA's Risk Reduction Engineering Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from the authors.
Caption title. Shipping list no.: 91-553-P. "July 1991." "EPA/600-M-91-021."