Record Display for the EPA National Library Catalog


OLS Field Name OLS Field Data
Main Title Waste minimization assessment for a manufacturer of printed circuit boards /
Author Kirsch, F. William. ; Looby., G. P.
Other Authors
Author Title of a Work
Looby, Gwen P.
CORP Author University City Science Center, Philadelphia, PA.;Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab.
Publisher U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory,
Year Published 1991
Report Number EPA/600-M-91-022; EPA-R-814903
Stock Number PB91-234542
OCLC Number 24997380
Subjects Waste minimization--Research--Colorado. ; Printed circuits--Research--Colorado. ; Printed circuits industry--Environmental aspects--Colorado.
Additional Subjects Hazardous materials ; Waste management ; Pollution abatement ; Circuit boards ; Assessments ; Industrial wastes ; Electroplating ; Sulfuric acid ; Liquid wastes ; Metals ; Cleaning ; Soldering alloys ; Waste minimization ; Electroless plating ; Source reduction ; SIC 20-39
Internet Access
Description Access URL
Library Call Number Additional Info Location Last
EHAM  TD793.9.K573 1991 Region 1 Library/Boston,MA 04/29/2016
EJBD ARCHIVE EPA 600-M-91-022 In Binder Headquarters Library/Washington,DC 02/15/2017
EJBD  EPA 600-M-91-022 c.1-2 Headquarters Library/Washington,DC 08/02/2013
EJED  EPA 600/M-91-022 OCSPP Chemical Library/Washington,DC 05/07/1999
ELBD RPS EPA 600-M-91-022 repository copy AWBERC Library/Cincinnati,OH 10/17/2014
NTIS  PB91-234542 Most EPA libraries have a fiche copy filed under the call number shown. Check with individual libraries about paper copy. 01/01/1988
Collation 6 pages : illustrations ; 28 cm.
The U.S. Environmental Protection Agency (EPA) has funded a pilot project to assist small- and medium-size manufacturers who want to minimize their generation of hazardous waste but who lack the expertise to do so. Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual (EPA/625/7-88/003, July 1988). The WMAC team at Colorado State University inspected a plant producing printed circuit boards -- a plant that already had taken steps to control its hazardous wastes. Producing a circuit board involves many major processes and subprocesses: preparing the board; depositing copper on the board by electroless plating; applying dry film; electrolytically plating copper; electrolytically plating tin; etching and stripping; applying solder; and, perhaps, plating gold on connectors. Each of these steps produces hazardous wastes, e.g., electrolytic copper plating results in acid soap dumps, copper and tin drag-out, and sulfuric acid. The main sources of metallic contamination (copper (both dissolved and metallic), tin, lead, gold) are the rinses after scrubbing, plating, and etching. Although the greatest amount of waste can be reduced by reusing effluent from the MEMTEK (with some further treatment), the greatest dollar savings can be found by changing the dry film developer. The present brand adheres strongly to the unexposed film and requires an aggressive acid soap; a less aggressive, nonhazardous soap could be used with a less-adhering dry film developer. The Research Brief was developed by the principal investigators and EPA's Risk Reduction Engineering Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from the authors.
Caption title. Shipping list no.: 91-553-P. "July 1991." "EPA/600-M-91-022."