Main Title |
Waste minimization assessment for a manufacturer of silicon-controlled rectifiers and Schottky rectifiers / |
Author |
Edwards, H. W. ;
Kostrzewa, M. ;
Miller, P. S. ;
Looby, G. P.
|
Other Authors |
|
CORP Author |
Colorado State Univ., Fort Collins. Dept. of Mechanical Engineering. ;University City Science Center, Philadelphia, PA.;Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab. |
Publisher |
U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory, |
Year Published |
1992 |
Report Number |
EPA/600-S-92-036; EPA-R-814903; PB93123099 |
Stock Number |
PB93-123099 |
OCLC Number |
26987803 |
Subjects |
Waste minimization--Research--Colorado ;
Rectifier instruments--Research--Colorado
|
Additional Subjects |
Waste management ;
Pollution abatement ;
Hazardous materials ;
Silicon controlled rectifiers ;
Manufacturing ;
Waste water ;
Water pollution control ;
Chemical vapor deposition ;
Air pollution control ;
Rinsing ;
Wafers ;
Etching ;
Cleaning ;
Waste minimization ;
Schottky rectifiers ;
Source reduction ;
SIC 20-39
|
Internet Access |
|
Holdings |
Library |
Call Number |
Additional Info |
Location |
Last Modified |
Checkout Status |
EHAM |
TD793.9E33 1992 |
|
Region 1 Library/Boston,MA |
04/29/2016 |
EJBD |
EPA 600-S-92-036 |
c.1-2 |
Headquarters Library/Washington,DC |
04/25/2014 |
EJED |
EPA/600/S-92/036 |
|
OCSPP Chemical Library/Washington,DC |
10/05/2001 |
ELBD ARCHIVE |
EPA 600-S-92-036 |
In Binder Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
ELBD RPS |
EPA 600-S-92-036 |
repository copy |
AWBERC Library/Cincinnati,OH |
02/01/2016 |
EMBD |
EPA/600/S-92/036 |
|
NRMRL/GWERD Library/Ada,OK |
12/28/2001 |
NTIS |
PB93-123099 |
Some EPA libraries have a fiche copy filed under the call number shown. |
|
07/26/2022 |
|
Collation |
1 volume. |
Abstract |
The WMAC team at Colorado State University performed an assessment at a plant manufacturing devices for converting alternating current into direct current (silicon-controlled rectifiers and Schottky rectifiers) -- approximately 2.5 million units per year. Rectifier manufacture is a two step process: wafer fabrication and assembly. Silicon wafers are doped, spin coated, cleaned, and rinsed. Next, the wafers are etched and the resist is stripped to produce a final groove pattern. Layers of polysilicate and silicon nitride are deposited via chemical vapor deposition, silicon glass is fused to the surface ground, and then the wafer is cut into chips or dice. The dice are tested, sorted, and evaluated and then transferred to assembly. The team's report, detailing findings and recommendatios, indicated that the majority of waste was generated by the stack scrubbers used to remove contaminants from exhausted plant air and that the greatest savings could be obtained by redirecting reject water from the reverse osmosis unit to the stack scrubbers to eliminate the wastewater stream from the reverse osmosis unit. |
Notes |
"EPA/600-S-92-036." "Sept. 1992." Shipping list no.: 92-0605-P. |