Grantee Research Project Results
Selected Publications Details for Grant Number SU835938
Green Nanosolder Paste for Next Generation Electronics Assembly and Manufacturing
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Reference Type | Citation | Progress Report Year | Document Sources |
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Journal Article | Wernicki E, Fratto E, Shu Y, Gao F, Gu Z. Micro-scale solder joints between Cu-Cu wires formed by nanoparticle enabled lead-free solder pastes. In2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016;1203-1208. |
SU835938 (Final) |
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The perspectives, information and conclusions conveyed in research project abstracts, progress reports, final reports, journal abstracts and journal publications convey the viewpoints of the principal investigator and may not represent the views and policies of ORD and EPA. Conclusions drawn by the principal investigators have not been reviewed by the Agency.