Grantee Research Project Results
Publications Details for Grant Number SU835938
Green Nanosolder Paste for Next Generation Electronics Assembly and Manufacturing
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| Reference Type | Citation | Progress Report Year | Document Sources |
|---|---|---|---|
| Dissertation/Thesis | Essigmann M. Synthesis and characterization of low-melting temperature lead-free tin/indium (Sn/In) nanosphere particles through the polyol method. Masters Thesis, University of Massachusetts Lowell, May 2018. |
SU835938 (Final) |
not available |
| Dissertation/Thesis | Kepner R. Effect of tin-indium nanoparticle additions to the thermal properties and intermetallic compounds of tin-silver-copper composite solder paste. Master’s Thesis, University of Massachusetts Lowell, August 2019. |
SU835938 (Final) |
not available |
| Dissertation/Thesis | Wernicki E. synthesis and characterization of novel Pb-free nanocomposite solder pastes for electronics assembly and packaging. Ph.D. Dissertation, University of Massachusetts Lowell, December 2019. |
SU835938 (Final) |
not available |
| Journal Article | Wernicki E, Fratto E, Shu Y, Gao F, Gu Z. Micro-scale solder joints between Cu-Cu wires formed by nanoparticle enabled lead-free solder pastes. In2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016;1203-1208. |
SU835938 (Final) |
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| Presentation | Fratto E, Wernicki E, Shu Y, Wang J, Gao F, Gu Z. Green nanosolder paste for next-generation electronics assembly and manufacturing. Presented at the 18th UMassLowell Student Research and Community Engagement Symposium, Lowell, MA, April 21, 2015. |
SU835710 (Final) SU835938 (Final) |
not available |
| Presentation | Wang J, Su J, Gao F, Sun H, Gu Z. Magnetic assembly and soldering of multisegment metallic nanowires. Presented at the Materials Research Society (MRS) Fall Meeting & Exhibit, Boston, MA, November 26-December 1, 2017. |
SU835938 (2017) SU835938 (Final) |
not available |
| Presentation | Wang J, Gao F, Li Z, Gu Z. Synthesis and nano-joining of multi-segmented metallic nanowire. Presented at the Materials Science & Technology Conference and Exhibition (MS&T), Pittsburgh, PA, October 8-12, 2017. |
SU835938 (2017) SU835938 (Final) |
not available |
| Presentation | Wernicki E, Gao F, Morose G, Gu Z. Development of Pb-free and halogen-free nanosolder paste for electronics assembly and packaging. Presented at the International Microelectronics Assembly and Packaging Society New England 42nd Symposium and Expo, Boxborough, MA, May 5, 2015. |
SU835710 (Final) SU835938 (Final) |
not available |
| Presentation | Wernicki E, Fratto E, Shu Y, Gao F, Gu Z. Micro-scale Cu-Cu wire joining via lead-free nanosolder pastes. Presented at the International Conference on Nanojoining and Microjoining 2016 (NMJ-2016), Niagara Falls, Ontario, Canada, September 25-28, 2016. |
SU835938 (2016) SU835938 (Final) |
not available |
| Presentation | Wernicki E, Fratto E, Shu Y, Gao F, Gu Z. Micro-scale solder joints between Cu-Cu wires formed by nanoparticle enabled lead-free solder pastes. Presented at the IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 31-June 3, 2016. |
SU835938 (2016) SU835938 (Final) |
not available |
| Presentation | Wernicki E, Gao F, Morose G, Gu Z. Development of Pb-free and halogen-free nanosolder paste for electronics assembly and packaging. Presented at the 144th The Minerals, Metals and Materials Society Annual Meeting and Exhibition, Orlando, FL, March 15-19, 2015. |
SU835710 (Final) SU835938 (Final) |
not available |
| Presentation | Wernicki E, Gu Z. Nanoparticle-enhanced lead-free solder pastes for electronics assembly and packaging. Presented at the Futurecar: New Era of Automotive Electronics Workshop, Atlanta, GA, November 9-10, 2016. |
SU835938 (2017) SU835938 (Final) |
not available |
| Presentation | Wang J, Su J, Gao F, Sun H, Gu Z. Electrodeposition of multi-segment metallic nanowires and their self-assembling applicaitons. Presented at the 68th Annual Meeting of the International Society of Electrochemistry (ISE), Providence, RI, August 27-September 1, 2017. |
SU835938 (2017) SU835938 (Final) |
not available |
| Presentation | Wang J, Su J, Su C, Gao F, Sun,H, Gu Z. Soldering of self-assembled multisegment metallic nanowires and their applications. Presented at the Futurecar: New Era of Automotive Electronics Workshop, Atlanta, GA, November 8-10, 2017. |
SU835938 (2017) SU835938 (Final) |
not available |
| Presentation | Wang J, Gao F, Gu Z. Investigation of melting behavior and morphology change of Sn nanowires based on infra-red (IR) heating method. Presented at the TMS 146th Annual Meeting & Exhibition, San Diego, CA, February 26-March 2, 2017. |
SU835938 (2017) SU835938 (Final) |
not available |
| Proceedings | Wang J, Gao F, Gu Z. Infrared (IR) soldering of metallic nanowires. In: Proceedings of the IEEE 67th Electronic Components and Technology Conference (ECTC), May 30-June 2, 2017, pp. 2175-2180. |
SU835938 (2017) SU835938 (Final) |
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The perspectives, information and conclusions conveyed in research project abstracts, progress reports, final reports, journal abstracts and journal publications convey the viewpoints of the principal investigator and may not represent the views and policies of ORD and EPA. Conclusions drawn by the principal investigators have not been reviewed by the Agency.