Grantee Research Project Results
Publications submitted after final report Details for Grant Number R831489
Fundamental Understanding and Performance Enhancement of Conductive Adhesive for Microelectronic Packaging Applications
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| Reference Type | Citation | Progress Report Year (Date Added to Report) | Document Sources |
|---|---|---|---|
| Journal Article | Dong H, Fan L, Moon K-S, Wong CP, Baskes MI. MEAM molecular dynamics study of lead free solder for electronic packaging applications. Modelling and Simulation in Materials Science and Engineering 2005;13(8):1279. |
R831489 (Final) (04/09/18) |
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| Journal Article | Jiang H, Zhu L, Moon K-S, Wong CP. Low temperature carbon nanotube film transfer via conductive polymer composites. Nanotechnology 2007;18(12):125203 (4 pp.). |
R831489 (Final) (04/09/18) |
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| Patent/Patent Application | Wong CP, Rao Y. High dielectric constant nano-structure polymer-ceramic composite. U.S. Patent No. 6,544,651, April 8, 2003. |
R831489 (Final) (08/10/10) |
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| Patent/Patent Application | Zhu L, Wong CP. Aligned carbon nanotubes and method for construction thereof. U.S. Patent Pending, April 17, 2008. |
R831489 (Final) (08/10/10) |
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| Proceedings | Jiang H, Moon K, Li Y, Wong CP. Ultra high conductivity of isotropic conductive adhesives. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 485-490. |
R831489 (Final) (09/09/22) |
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| Proceedings | Jiang H, Zhu L, Moon K, Li Y, Wong C. Low temperature carbon nanotube film transfer via conductive adhesives. 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS 2007; |
R831489 (Final) (07/29/22) |
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| Proceedings | Li Y, Moon K, Wong CP. Effects of reducing agents on the electrical properties of electrically conductive adhesives. In: Proceedings of the 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, March 15-17, 2006, pp. 179-183. |
R831489 (Final) (09/09/22) |
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| Proceedings | Li Y, Wong CP. Silver migration control in electrically conductive adhesives. In: Proceedings of the 8th Institute of Electrical and Electronics Engineers (IEEE) Components, Packaging and Manufacturing Technology (CPMT) International Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’06), Shanghai, China, June 27-30, 2006, pp. 206-212. |
R831489 (Final) (09/09/22) |
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| Proceedings | Li Y, Yim M, Moon K, Wong C. High performance nano-scale conductive films with low temperature sintering for fine pitch electronic interconnect. PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION 2007;1-7 |
R831489 (Final) (09/09/22) |
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| Proceedings | Li Y, Yim MJ, Moon K, Wong CP. Nano-scale conductive films with low temperature sintering for high performance fine pitch interconnect. In: Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, NV, May 29-June 1, 2007, pp.1350-1355. |
R831489 (Final) (09/09/22) |
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