| Main Title |
Guides to pollution prevention : the printed circuit board manufacturing industry. |
| CORP Author |
Jacobs Engineering Group, Inc., Pasadena, CA.;Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab. |
| Publisher |
Risk Reduction Engineering Laboratory, and Center for Environmental Research Information, Office of Research and Development, U.S. Environmental Protection Agency, |
| Year Published |
1990 |
| Report Number |
EPA/625/7-90/007; EPA-68-02-4286; PB90256413 |
| Stock Number |
PB90-256413 |
| OCLC Number |
22259004 |
| Subjects |
Printed circuits industry--Waste disposal--United States--Handbooks, manuals, etc
|
| Additional Subjects |
Industrial wastes ;
Printed circuits ;
Guidelines ;
Waste treatment ;
Cleaning ;
Forms(Paper) ;
Hazardous materials ;
Catalysts ;
Solvents ;
Process charting ;
Materials handling ;
Industrial waste treatment ;
Water pollution ;
Electroplating ;
Etching ;
Operating ;
Air pollution control ;
Electroless plating ;
Waste management ;
Pollution abatement ;
Source reduction ;
Case studies ;
Waste recycling
|
| Internet Access |
|
| Holdings |
| Library |
Call Number |
Additional Info |
Location |
Last
Modified |
Checkout
Status |
| EHAM |
TD899.P69G85 1990 |
|
Region 1 Library/Boston,MA |
04/29/2016 |
| EJED |
EPA 625-7-90-007 |
|
OCSPP Chemical Library/Washington,DC |
01/01/1988 |
| EKBD |
EPA-625/7-90-007 |
|
Research Triangle Park Library/RTP, NC |
02/22/1991 |
| ELBD ARCHIVE |
EPA 625-7-90-007 |
Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
DISPERSAL |
| ERAD |
EPA 625/7-90-007 |
|
Region 9 Library/San Francisco,CA |
03/06/2013 |
| ESAD |
EPA 625-7-90-007 |
2 copies |
Region 10 Library/Seattle,WA |
06/03/2016 |
| NTIS |
PB90-256413 |
Some EPA libraries have a fiche copy filed under the call number shown. |
|
07/26/2022 |
|
| Collation |
v, 77 pages : illustrations ; 28 cm |
| Abstract |
The guide identifies and analyzes waste minimization methodologies appropriate for the printed circuit board manufacturing industry. The wastes resulting from printed circuit board manufacturing are associated with five types of processes: cleaning and surface preparation; catalyst application and electroless plating; pattern printing and masking; electroplating; and etching. The wastes themselves include airborne particulates, spent acids and alkaline solutions, spent solvents, spent plating baths, waste rinsewater, and other wastes. The guide also presents a set of detailed waste minimization assessment worksheets suitable for use by shop managers and engineers, or by outside consultants, to formulate a waste minimization strategy for the particular plant. Finally, case histories of waste minimization assessments performed at three plants are given. |
| Notes |
Shipping list no.: 90-509-P. "June 1990." Includes bibliographical references. "EPA/625/7-90/007." |
| Place Published |
Cincinnati, Ohio |
| Supplementary Notes |
Sponsored by Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab. |
| Corporate Au Added Ent |
Risk Reduction Engineering Laboratory (U.S.); Center for Environmental Research Information (U.S.) |
| PUB Date Free Form |
1990 |
| NTIS Prices |
PC A05/MF A01 |
| BIB Level |
m |
| Medium |
unmediated |
| Content |
text |
| Carrier |
volume |
| Cataloging Source |
OCLC/T |
| Merged OCLC records |
1225762004 |
| OCLC Time Stamp |
20160419144405 |
| Language |
eng |
| SUDOCS Number |
EP 1.8:P 76/3 |
| Origin |
OCLC |
| Type |
MERGE |
| OCLC Rec Leader |
01669cam 2200409Ia 45020 |
