The Printed Wiring Board Surface Finishes Cleaner Technologies Substitutes Assessment: Volume 1 is a technical document that presents comparative risk, competitiveness, and resource requirements information on six technologies for performing the surface finishing function during printed wiring board (PWB) manufacturing. Surface finishing technologies are used by PWB manufacturers to deposit a coating on the outside surfaces of the PWB that provides a solderable surface for future assembly, while also protecting the surface from contamination. The technologies evaluated include hot air solder leveling (HASL), electroless nickel/immersion gold (nickel/gold), electroless nickel/immersion palladium/immersion gold (nickel/palladium/gold), organic solderability preservative (OSP), immersion silver, and immersion tin. Volume I describes the surface finishing technologies, methods used to assess the technologies, and Cleaner Technologies Substitutes Assessment (CTSA) results. Volume II contains appendices, including detailed chemical properties and methodology information.