Grantee Research Project Results
Publications Details for Grant Number R831456
Comprehensive Tools to Assess Environmental Impacts of and Improve the Design of Semiconductor Equipment and Processes
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| Reference Type | Citation | Progress Report Year | Document Sources |
|---|---|---|---|
| Presentation | Boyd S, Dornfeld D, Krishnan N, Moalem M. Environmental challenges for 45-nm and 32-nm node CMOS logic. Presented at the IEEE International Symposium on Electronics and Environment (ISEE), May 2007. |
R831456 (Final) |
not available |
| Presentation | Yuan C. A decision-based analysis of compressed air usage patterns in automotive manufacturing. Presented at the Ford Motor Company, Seminar, Dearborn, MI, April 27, 2005. |
R831456 (2005) R831456 (Final) |
not available |
| Presentation | Zhang TW, Bates SW, Dornfeld DA. Operational energy use of plasmonic imaging lithography. Presented at the IEEE International Symposium on Electronics and Environment (ISEE), May 2007. |
R831456 (Final) |
not available |
| Presentation | Zhang T, Boyd S, Vijayaraghavan A, Dornfeld D. Energy use in nanoscale manufacturing. Presented at the 2006 IEEE International Symposium on Electronics and Environment (ISEE), IEEE, San Francisco, May 2006. |
R831456 (Final) |
not available |
| Presentation | Zhang T, Dornfeld D. Energy use per worker-hour: evaluating the contribution of labor to manufacturing energy use. Presented at the 14th CIRP International Conference on Life Cycle Engineering, Waseda University, Tokyo, Japan, June 2007. |
R831456 (Final) |
not available |
| Proceedings | Boyd S, Dornfield D, Krishnan N. Life cycle inventory of a CMOS chip. PROCEEDINGS OF THE 2006 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS & THE ENVIRONMENT, CONFERENCE RECORD 2006;253 |
R831456 (Final) |
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| Proceedings | Boyd S, Dornfeld D, Krishnan N. Life cycle inventory of a CMOS chip. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 2006, pp. 253-257. |
R831456 (2005) R831456 (Final) |
not available |
| Proceedings | Boyd S, Dornfeld D, Krishnan N, Moalem M. Environmental challenges for 45-nm and 32-nm node CMOS logic. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and Environment, Orlando, FL, May 2007, pp. 102-105. |
R831456 (Final) |
not available |
| Proceedings | Zhang TW, Boyd S, Vijayaraghavan A, Dornfeld D. Energy use in nanoscale manufacturing. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and Environment, San Francisco, CA, May 2006, pp. 266-271. |
R831456 (Final) |
not available |
| Proceedings | Zhang TW, Dornfeld DA. Energy use per worker-hour: evaluating the contribution of labor to manufacturing energy use . In: Takata S, Umeda Y, eds. Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses: Proceedings of the 14th CIRP Conference on Life Cycle Engineering, Waseda University, Tokyo, Japan, June 11th–13th, 2007. London, UK: Springer 2007, pp. 189-193. |
R831456 (Final) |
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| Proceedings | Zhang TW, Bates SW, Dornfeld DA. Operational energy analysis of plasmonic imaging lithography. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and Environment, Orlando, FL, May 2007, pp. 99-101. |
R831456 (Final) |
not available |
| Proceedings | Zhang T, Bates S, Dornfield D. Operational energy analysis of plasmonic imaging lithography. PROCEEDINGS OF THE 2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS & THE ENVIRONMENT, CONFERENCE RECORD 2007;97 |
R831456 (Final) |
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The perspectives, information and conclusions conveyed in research project abstracts, progress reports, final reports, journal abstracts and journal publications convey the viewpoints of the principal investigator and may not represent the views and policies of ORD and EPA. Conclusions drawn by the principal investigators have not been reviewed by the Agency.