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AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS
Lewis*, N M. AND P. Bennett. AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS. Presented at AWMA Conference, Salt Lake City, UT, 06/21/2000.
The USEPA through NRMRL has partnered with the California Dept. of Toxic Substance Control under an ETV Pilot Project to verigy polllution prevention, recycling and waste treatment technologies. One of the projects selected for verification was the ultrasonic aqueous cleaning technology developed by the Smart Sonic Corp. located in Van Nuys, CA. Smart Sonic Corp. developed two ultrasonic aqueous cleaning systems as an aqueous alternative to solvent-based systems for cleaning various types of solder pastes from printed circuit board stencils.
Record Details:Record Type: DOCUMENT (PRESENTATION/PAPER)
Organization:U.S. ENVIRONMENTAL PROTECTION AGENCY
OFFICE OF RESEARCH AND DEVELOPMENT
NATIONAL RISK MANAGEMENT RESEARCH LABORATORY
SUSTAINABLE TECHNOLOGY DIVISION
MULTIMEDIA TECHNOLOGY BRANCH