Main Title |
No-Clean soldering to eliminate CFC-113 and methyl chloroform cleaning of printed circuit board assemblies / |
Other Authors |
|
Publisher |
United States Environmental Protection Agency, Air and Radiation, |
Year Published |
1993 |
Report Number |
EPA-430-B-93-005 |
OCLC Number |
32225517 |
Subjects |
Ozone layer depletion
|
Internet Access |
|
Holdings |
Library |
Call Number |
Additional Info |
Location |
Last Modified |
Checkout Status |
EJBD |
EPA 430/B-93-005 |
|
Headquarters Library/Washington,DC |
03/31/1995 |
ELBD ARCHIVE |
EPA 430/B-93-005 |
Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
|
Collation |
xii, 92 pages : illustrations ; 28 cm |
Notes |
ICOLP (Industry Cooperative for Ozone Layer Protection). "EPA-430-B-93-005"--Cover. "October 1993"--Cover. |
Place Published |
{Washington, DC} : |
Corporate Au Added Ent |
United States. Environmental Protection Agency. Office of Air and Radiation. ; Industry Cooperative for Ozone Layer Protection. ; United States. Environmental Protection Agency. Office of Air and Radiation. ; Industry Cooperative for Ozone Layer Protection. |
PUB Date Free Form |
{1993}. |
BIB Level |
m |
Cataloging Source |
OCLC/T |
OCLC Time Stamp |
19950330104754 |
Language |
ENG |
Origin |
OCLC |
Type |
CAT |
OCLC Rec Leader |
01023nam 2200253Ka 45020 |