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OLS Field Name OLS Field Data
Main Title Waste minimization assessment for a manufacturer producing printed circuit boards /
Author Edwards, Harry W. ; Kostrzewa, M. ; Miller, P. S.
Other Authors
Author Title of a Work
Kostrzewa, Michael.
Miller, Phylissa S.
CORP Author Colorado State Univ., Fort Collins. Dept. of Mechanical Engineering. ;University City Science Center, Philadelphia, PA.;Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab.
Publisher U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory,
Year Published 1992
Report Number EPA-R-814903; EPA/600/S-92/033
Stock Number PB93-126621
Subjects Printed circuits industry--Research--Colorado.
Additional Subjects Waste management ; Hazardous materials ; Pollution abatement ; Printed circuits ; Manufacturing ; Waste water ; Plating ; Photolithography ; Water pollution control ; Rinsing ; Sludges ; Electrowinning ; Waste minimization ; Source reduction ; SIC 20-39
Internet Access
Description Access URL
Library Call Number Additional Info Location Last
NTIS  PB93-126621 Most EPA libraries have a fiche copy filed under the call number shown. Check with individual libraries about paper copy. NTIS 01/01/1988
Collation 1 volume.
Abstract The U.S. Environmental Protection Agency (EPA) has funded a pilot project to assist small- and medium-size manufacturers who want to minimize their generation of waste but who lack the expertise to do so. The WMAC team at Colorado State University performed an assessment at a plant which manufactures single-sided, double-sided, and multilayer printed circuit boards -- approximately 259,000 sq ft/yr. Circuit patterns are created on the boards and foil layers with a dry-film photoresist process and the multilayer boards are built up. The actual copper circuit pattern is generated by a series of photolithographic and plating processes. Final processing includes legend application, routing, rinsing, electrical testing, inspections, packing, and shipping. The team's report, detailing findings and recommendations, indicated that the majority of waste was generated in the plating lines and that the greatest savings could be obtained by installing a spray rinse and electrowinning system on the first rinse tank of the electrolytic copper plating line to reduce both copper plating rinse water (88 percent) and plating sludge (80 percent) due to drag-out in the first rinse tank.
Notes Microfiche.
Place Published Cincinnati, OH :
Supplementary Notes See also PB92-196344. Prepared in cooperation with University City Science Center, Philadelphia, PA. Sponsored by Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab.
Corporate Au Added Ent Risk Reduction Engineering Laboratory (U.S.)
PUB Date Free Form {1992}
Series Title Traced Environmental research brief
NTIS Prices PC A02/MF A01
BIB Level m
Cataloging Source OCLC/T
OCLC Time Stamp 20010313172721
Language eng
Origin NTIS
OCLC Rec Leader 01057nam 2200253Ka 45020