Main Title |
Implementing cleaner printed wiring board technologies : surface finishes / |
CORP Author |
Environmental Protection Agency, Washington, DC. Design for the Environment Branch. |
Publisher |
U.S. EPA, |
Year Published |
2000 |
Report Number |
EPA 744-R-00-002 |
Stock Number |
PB2001-108367 |
OCLC Number |
44441260 |
Subjects |
Printed circuits industry--Environmental aspects--United States ;
Printed circuits industry--Standards--United States ;
Electronic industries ;
Electronics industries
|
Additional Subjects |
Surface finishing ;
Pollution prevention ;
Technology ;
Interviews ;
Environmental protection ;
Manufacturing ;
Lessons learned ;
Public health ;
Cost effectiveness ;
Competition ;
Recommendations ;
Printed wiring boards
|
Internet Access |
|
Holdings |
Library |
Call Number |
Additional Info |
Location |
Last Modified |
Checkout Status |
EHAD |
EPA/744-R-00-002 |
|
Region 1 Library/Boston,MA |
01/26/2001 |
EJED |
EPA 744-R-00-002 |
|
OCSPP Chemical Library/Washington,DC |
01/11/2002 |
ELBD ARCHIVE |
EPA 744-R-00-002 |
Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
DISPERSAL |
ESAD |
EPA 744-R-00-002 |
|
Region 10 Library/Seattle,WA |
06/30/2000 |
NTIS |
PB2001-108367 |
Some EPA libraries have a fiche copy filed under the call number shown. |
|
07/26/2022 |
|
Collation |
41 p. ; 28 cm. |
Abstract |
Surface finishes are applied to printed wiring boards (PWBs) to prevent oxidation of exposed copper on the board, thus ensuring a solderable surface when components are added at a later processing stage. The most widely used surface finishing process in PWB manufacturing is hot air solder leveling (HASL). In this process, tin-lead is fused onto exposed copper surfaces. This process may pose potential health and environmental risks due to the use of lead, and the HASL process also generates significant quantities of excess solder that must be recycled. In addition, HASL does not provide a level (planar) soldering surface for fine pitch components. Several emerging surface finishes viewed as viable alternatives to HASL have been developed in recent years. These finishes eliminate the use of lead in the surface finishing process and produce a planar surface. For these reasons, the Design for the Environment (DfE) PWB Project team selected the surface finishing process as the focus of a study to identify technologies that perform competitively, are cost-effective, and pose fewer potential environmental and health risks. This Guide presents first-hand accounts of the problems, solutions, and time and effort involved in implementing alternative surface finish technologies. The information presented summarizes telephone and e-mail interviews with PWB manufacturers and assemblers currently using these technologies, and the suppliers of the alternative technologies. With the information from these interviews, manufacturers considering a switch to an alternative technology can benefit from the lessons learned by those who already have made the change. Five technologies are discussed in this Guide: immersion silver; immersion tin; organic solderability preservative (OSP); electroless nickel/immersion gold; and electroless nickel/electroless palladium/immersion gold. |
Notes |
"EPA 744-R-00-002"--Cover. "March 2000"--Cover. "United States Environmental Protection Agency."--Cover. "This document was produced under contract #68-W6-0021 from the U.S. EPA's Design for the Environment (DfE) Printed Wiring Board (PWB) Surface Finishes Project." |
Place Published |
Washington, D.C. |
Availability Notes |
Product reproduced from digital image. Order this product from NTIS by: phone at 1-800-553-NTIS (U.S. customers); (703)605-6000 (other countries); fax at (703)605-6900; and email at orders@ntis.gov. NTIS is located at 5285 Port Royal Road, Springfield, VA, 22161, USA. |
Corporate Au Added Ent |
United States. Environmental Protection Agency. Economics, Exposure, and Technology Division. Design for the Environmental Program. |
PUB Date Free Form |
2000 |
Series Title Traced |
Design for the environment |
Series Title Untraced |
Design for the environment |
NTIS Prices |
PC A04/MF A01 |
BIB Level |
m |
Medium |
microform |
Cataloging Source |
OCLC/T |
OCLC Time Stamp |
20100120165146 |
Language |
eng |
Origin |
OCLC |
Type |
MERGE |
OCLC Rec Leader |
01340cam 2200313Ka 45020 |