| Main Title |
No-Clean soldering to eliminate CFC-113 and methyl chloroform cleaning of printed circuit board assemblies / |
| Other Authors |
|
| Publisher |
United States Environmental Protection Agency, Air and Radiation, |
| Year Published |
1993 |
| Report Number |
EPA-430-B-93-005 |
| OCLC Number |
32225517 |
| Subjects |
Ozone layer depletion
|
| Internet Access |
|
| Holdings |
| Library |
Call Number |
Additional Info |
Location |
Last
Modified |
Checkout
Status |
| EJBD |
EPA 430/B-93-005 |
|
Headquarters Library/Washington,DC |
03/31/1995 |
| ELBD ARCHIVE |
EPA 430/B-93-005 |
Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
|
| Collation |
xii, 92 pages : illustrations ; 28 cm |
| Notes |
ICOLP (Industry Cooperative for Ozone Layer Protection). "EPA-430-B-93-005"--Cover. "October 1993"--Cover. |
| Place Published |
{Washington, DC} : |
| Corporate Au Added Ent |
United States. Environmental Protection Agency. Office of Air and Radiation. ; Industry Cooperative for Ozone Layer Protection. ; United States. Environmental Protection Agency. Office of Air and Radiation. ; Industry Cooperative for Ozone Layer Protection. |
| PUB Date Free Form |
{1993}. |
| BIB Level |
m |
| Cataloging Source |
OCLC/T |
| OCLC Time Stamp |
19950330104754 |
| Language |
ENG |
| Origin |
OCLC |
| Type |
CAT |
| OCLC Rec Leader |
01023nam 2200253Ka 45020 |
