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OLS Field Name OLS Field Data
Main Title Carbon-black dispersion preplating technology for printed wire board manufacturing : final technology evaluation report /
Author Folsom, D. W. ; Gavaskar, A. R. ; Jones, J. A. ; Olfenbuttel, R. F.
Other Authors
Author Title of a Work
Folsom, Dale W.
CORP Author Battelle, Columbus, OH.;Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab.
Publisher U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory,
Year Published 1993
Report Number EPA 600/R-93/201.; EPA-68-C0-0003
Stock Number PB94-114790
Subjects Protective coatings. ; Copper plating.
Additional Subjects Metal finishing ; Printed circuits ; Electroplating ; Manufacturing ; Pollution control ; Breadboard models ; Metal cleaning ; Reduction ; Sources ; Pollution abatement ; Recycling ; Carbon black ; Copper coatings ; Operations ; Cost engineering ; Economic analysis ; Chemical compounds ; Dispersion ; Waste minimization
Internet Access
Description Access URL
Library Call Number Additional Info Location Last
NTIS  PB94-114790 Most EPA libraries have a fiche copy filed under the call number shown. Check with individual libraries about paper copy. 01/01/1988
Collation 1 volume
Abstract The project compared chemical use, waste generation, cost, and product quality between electroless copper and carbon-black-based preplating technologies at the printed wire board (PWB) manufacturing facility of McCurdy Circuits in Orange, CA. The carbon-black based preplating technology evaluated is used as an alternative process for electroless copper (EC) plating of through-holes before electrolytic copper plating. The specific process used at McCurdy is the BlackHole (BH) technology process, which uses a dispersion of carbon black in an aqueous solution to provide a conductive surface for subsequent electrolytic copper plating. The carbon-black dispersion technology provided effective waste reduction and long-term cost savings. The economic analysis determined that the new process was cost efficient because chemical use was reduced and the process proved more efficient; the payback period was less than 4 yrs.
Notes Microfiche.
Place Published Cincinnati, OH :
Supplementary Notes Sponsored by Environmental Protection Agency, Cincinnati, OH. Risk Reduction Engineering Lab.
Corporate Au Added Ent Risk Reduction Engineering Laboratory (U.S.)
PUB Date Free Form {1993}
Ti Tra Differently Carbon black dispersion preplating technology for printed wire board manufacturing.
NTIS Prices PC A03/MF A01
BIB Level m
Cataloging Source OCLC/T
OCLC Time Stamp 20030723175946
Language eng
Origin NTIS
OCLC Rec Leader 01007nam 2200253Ka 45020