Main Title |
Design for the Environment, lead-free solder partnership : assessing life-cycle impacts in the electronics industry. |
Publisher |
U.S. Environmental Protection Agency, Office of Pollution Prevention and Toxics], |
Year Published |
2002 |
Report Number |
EPA 744-F-02-007 |
OCLC Number |
649474078 |
Subjects |
Solder and soldering--Environmental aspects ;
Electronic industries--Environmental aspects
|
Additional Subjects |
Design for the Environment Program (US)
|
Internet Access |
|
Holdings |
Library |
Call Number |
Additional Info |
Location |
Last Modified |
Checkout Status |
ELBD ARCHIVE |
EPA 744-F-02-007 |
Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
|
Collation |
1 sheet ([2] p.) : ill. ; 28 x 22 cm. |
Notes |
Caption title. "June 2002". "EPA 744-F-02-007"--P. [2]. |