Main Title |
Alternative technologies for surface finishing : cleaner technologies for printed wiring board manufacturers. |
CORP Author |
Abt Associates, Inc., Washington, DC.;Environmental Protection Agency, Washington, DC. Office of Pollution, Prevention, and Toxics. |
Publisher |
U.S. Environmental Protection Agency, Office of Pollution Prevention and Toxics, |
Year Published |
2001 |
Report Number |
EPA-744-R-01-001; EPA-68-W6-0021 |
Stock Number |
PB2005-109328 |
OCLC Number |
58920324 |
Subjects |
Printed circuits industry--Environmental aspects ;
Printed circuits industry--Standards
|
Additional Subjects |
Surface finishing ;
Technology ;
Printed wiring boards ;
Alternative technologies ;
Cleaner technologies ;
Electronic devices ;
Copper ;
Corrosion ;
Protection ;
Soldering ;
Printed wiring board (PWB) ;
Hot air solder leveling (HASL)
|
Internet Access |
|
Holdings |
Library |
Call Number |
Additional Info |
Location |
Last Modified |
Checkout Status |
EJBD |
EPA 744-R-01-001 |
c.1 |
Headquarters Library/Washington,DC |
06/11/2014 |
EJED |
EPA 744/R-01/001 |
|
OCSPP Chemical Library/Washington,DC |
09/06/2005 |
ELBD ARCHIVE |
EPA 744-R-01-001 |
Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
ERAD |
EPA 744/R-01-001 |
|
Region 9 Library/San Francisco,CA |
03/18/2013 |
NTIS |
PB2005-109328 |
Some EPA libraries have a fiche copy filed under the call number shown. |
|
07/26/2022 |
|
Collation |
42 p. : ill. ; 28 cm. |
Abstract |
This project researched how alternative surface finishes compare to the performance, cost, and environmental and health characteristics of (Hot Air Soldering Leveling) HASL. |
Notes |
"EPA-744-R-01-001"--Cover. "June 2001"--Cover. |