Record Display for the EPA National Library Catalog
RECORD NUMBER: 11 OF 16
|OLS Field Name||OLS Field Data|
|Main Title||Printed wiring board : surface finishes : draft cleaner technologies substitutes assessment.|
|CORP Author||Tennessee Univ., Knoxville. Center for Clean Products and Clean Technologies.;Environmental Protection Agency, Washington, DC. Office of Pollution, Prevention, and Toxics.|
|Publisher||University of Tennessee Center for Clean Products and Clean Technologies ; U.S. Environmental Protection Agency,|
|Report Number||EPA 744-R-00-013; EPA 744-R-00-013A; EPA 744-R-00-013B|
|Subjects||Finishes and finishing. ; Surfaces (Technology) ; Surface preparation.|
|Additional Subjects||Printed circuit boards ; Surface finishes ; Assessment methods ; Surfaces ; Manufacturing ; Risks ; Competitiveness ; Resource requirements ; Coatings ; Cleaner Technologies Substitutes Assessment ; Printed wiring boards|
|Collation||2 v. : ill. ; 30 cm.|
The Printed Wiring Board Surface Finishes Cleaner Technologies Substitutes Assessment: technical document presents comparative risk, competitiveness, and resource requirements information on six technologies for performing the surface finishing function during printed wiring board (PWB) manufacturing. Surface finishing technologies are used by PWB manufacturers to deposit a coating on the outside surfaces of the PWB that provides a solderable surface for future assembly, while also protecting the surface from contamination. The technologies evaluated include hot air solder leveling (HASL), electroless nickel/palladium/gold (nickel/gold), electroless nickel immersion palladium/immersion gold (nickel/palladium/gold), organic solderability preservative (OSP), immersion silver, and immersion tin. Volume II contains appendices, including detailed chemical properties and methodology information.
"December 2000." "EPA 744-R-00-013A"--Vol. 1. "EPA 744-R-00-013B"--Vol. 2. Includes bibliographical references.
v. 1. [without special title] -- v. 2. Appendices.