Record Display for the EPA National Library Catalog

RECORD NUMBER: 9 OF 15

OLS Field Name OLS Field Data
Main Title Printed Wiring Board Surface Finishes. Cleaner Technologies Substitutes Assessment, Volume 1.
Author Geibig, J. R. ; Swanson, M. B. ;
CORP Author Tennessee Univ., Knoxville. Center for Clean Products and Clean Technologies.;Environmental Protection Agency, Washington, DC. Office of Research and Development.
Publisher 2002
Year Published 2002
Stock Number PB2002-108876
Additional Subjects Printed circuit devices ; Surface finishes ; Assessment methods ; Risks ; Surfaces ; Manufacturing ; Competitiveness ; Coatings ; Resource requirement ; Cleaner Technologies Substitutes Assessment ; Printed wiring boards
Holdings
Library Call Number Additional Info Location Last
Modified
Checkout
Status
NTIS  PB2002-108876 Most EPA libraries have a fiche copy filed under the call number shown. Check with individual libraries about paper copy. NTIS 10/23/2002
Collation CD-ROM
Abstract
The Printed Wiring Board Surface Finishes Cleaner Technologies Substitutes Assessment: Volume 1 is a technical document that presents comparative risk, competitiveness, and resource requirements information on six technologies for performing the surface finishing function during printed wiring board (PWB) manufacturing. Surface finishing technologies are used by PWB manufacturers to deposit a coating on the outside surfaces of the PWB that provides a solderable surface for future assembly, while also protecting the surface from contamination. The technologies evaluated include hot air solder leveling (HASL), electroless nickel/immersion gold (nickel/gold), electroless nickel/immersion palladium/immersion gold (nickel/palladium/gold), organic solderability preservative (OSP), immersion silver, and immersion tin. Volume I describes the surface finishing technologies, methods used to assess the technologies, and Cleaner Technologies Substitutes Assessment (CTSA) results. Volume II contains appendices, including detailed chemical properties and methodology information.