| Main Title |
Design for the Environment, lead-free solder partnership : assessing life-cycle impacts in the electronics industry. |
| Publisher |
U.S. Environmental Protection Agency, Office of Pollution Prevention and Toxics], |
| Year Published |
2002 |
| Report Number |
EPA 744-F-02-007 |
| OCLC Number |
649474078 |
| Subjects |
Solder and soldering--Environmental aspects ;
Electronic industries--Environmental aspects
|
| Additional Subjects |
Design for the Environment Program (US)
|
| Internet Access |
|
| Holdings |
| Library |
Call Number |
Additional Info |
Location |
Last
Modified |
Checkout
Status |
| ELBD ARCHIVE |
EPA 744-F-02-007 |
Received from HQ |
AWBERC Library/Cincinnati,OH |
10/04/2023 |
|
| Collation |
1 sheet ([2] p.) : ill. ; 28 x 22 cm. |
| Notes |
Caption title. "June 2002". "EPA 744-F-02-007"--P. [2]. |
