||Impact of lead and other metallic solders on water quality /
Murrell, Norman E.
||Holzmacher, McLendon and Murrell, Melville, NY. ;South Huntington Water District, Huntington Station, NY.;Environmental Protection Agency, Cincinnati, OH. Drinking Water Research Div.
|| Risk Reduction Engineering Laboratory, U.S. Environmental Protection Agency,
Drinking water--Lead content ;
Plumbing fixtures ;
Lead--Health aspects of ;
Potable waters ;
Water quality ;
Chemical analysis ;
Field tests ;
South Huntington Water District(New York) ;
Suffolk County(New York)
||Some EPA libraries have a fiche copy filed under the call number shown.
||xiii, 84 p. ; 28 cm.
A study of the relationship between water quality at the consumer's taps and the corrosion of lead solder was conducted under actual field conditions in 90 homes supplied by public water in the South Huntington Water District (New York) and at 14 houses supplied by private wells in Suffolk County on Long Island (New York). The study was done in three phases three different pH ranges (5.0-6.8, 7.0-7.4, and 8.0 and greater). The phase I study was preformed without any pH adjustments on the water sources. Phase II and III studies consisted of raising the pH by the addition of caustic soda and maintaining pH for thirty days prior to the sampling. After an overnight period of nonuse, a series of samples were collected at specific time intervals to evaluate the effect of time on the leaching rate of lead. Data were collected on leaching of cadmium and copper and water quality parameters were monitored. In the 2nd part of the investigation, a more controlled, four-pipe loop study was conducted with the same corrosive Long Island water. Each pipe loop consisted of approximately 60 feet of copper pipe with 22 solder joints, each loop having a different type of solder: (1) tin/lead; (2) tin/antimony; (3) silver/copper, and (4) tin/copper. The four loop solder test results indicate the tin/antimony, silver/copper, and tin/copper can be used with only minor metal leaching.
EPA/600/2-90/056. PB91-125724. Includes bibliographical references. Photocopy.