TY  - CHAP
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K 
A1  - Wong, C P
T1  - Electrically conductive adhesives.
Y1  - 2008/11/20
N1  - R831489
SP  - 11
EP  - 12--11-24
PB  - CRC Press
ER  - 


TY  - JOUR
A1  - Chiang, H 
A1  - Chung, C 
A1  - Chen, L 
A1  - Li, Y 
A1  - Wong, C P
A1  - Fu, S 
T1  - Processing and shape effects on silver paste electrically conductive adhesives (ECAs).
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
J1  - J ADHES SCI TECHNOL
VL  - 19
IS  - 7
SP  - 565
EP  - 578
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate.
Y1  - 2004//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 33
IS  - 11
SP  - 1326
EP  - 1330
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Zhang, Z 
A1  - Wong, C P
T1  - Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications.
Y1  - 2005/01/1
N1  - R831489
JF  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
J1  - J ADHES SCI TECHNOL
VL  - 19
IS  - 2
SP  - 87
EP  - 94
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Fan, L 
A1  - Moon, K 
A1  - Wong, C P
A1  - Baskes, M I
T1  - MEAM molecular dynamics study of lead free solder for electronic packaging applications.
Y1  - 2005/11/4
N1  - R831489
JF  - MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING
J1  - MODEL SIMUL MATER SC
VL  - 13
IS  - 8
SP  - 1279
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 1
SP  - 40
EP  - 45
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Meininger, A 
A1  - Jiang, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Magnetic nanocomposite for potential ultrahigh frequency microelectronic application.
Y1  - 2007/04/25
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIAL
VL  - 36
IS  - 5
SP  - 593
EP  - 597
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K S
A1  - Wong, C P
T1  - Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules.
Y1  - 2007/02/26
N1  - R831489
JF  - APPLIED PHYSICS LETTERS
J1  - APPL PHYS LETT
VL  - 90
IS  - 9
SP  - 092102 (3 pp.)
ER  - 


TY  - JOUR
A1  - Jiang, H J
A1  - Moon, K 
A1  - Zhang, Z Q
A1  - Pothukuchi, S 
A1  - Wong, C P
T1  - Variable frequency microwave synthesis of silver nanoparticles.
Y1  - 2006//
N1  - R831489
JF  - JOURNAL OF NANOPARTICLE RESEARCH
VL  - 8
IS  - 1
SP  - 117
EP  - 124
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Moon, K 
A1  - Lu, J 
A1  - Wong, C P
T1  - Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization.
Y1  - 2005/11/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 11
SP  - 1432
EP  - 1439
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Moon, K 
A1  - Li, Y 
A1  - Wong, C P
T1  - Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites.
Y1  - 2006/06/27
N1  - R831489
JF  - CHEMISTRY OF MATERIALS
J1  - CHEM MATER
VL  - 18
IS  - 13
SP  - 2969
EP  - 2973
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Moon, K 
A1  - Hua, F 
A1  - Wong, C P
T1  - Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders.
Y1  - 2007/08/11
N1  - R831489
JF  - CHEMISTRY OF MATERIALS
J1  - CHEM MATER
VL  - 19
IS  - 18
SP  - 4482
EP  - 4485
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Zhu, L 
A1  - Moon, K 
A1  - Wong, C P
T1  - Low temperature carbon nanotube film transfer via conductive polymer composites.
Y1  - 2007/02/23
N1  - R831489
JF  - NANOTECHNOLOGY
J1  - ACS SYM SER
J2  - NANOTECHNOLOGY
VL  - 18
IS  - 12
SP  - 125203 (4 pp.)
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Zhu, L 
A1  - Moon, K 
A1  - Wong, C P
T1  - The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production.
Y1  - 2007/03/
N1  - R831489
JF  - CARBON
J1  - CARBON
VL  - 45
IS  - 3
SP  - 655
EP  - 661
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Moon, K 
A1  - Sun, Y 
A1  - Wong, C P
A1  - Hua, F 
A1  - Pal, T 
A1  - Pal, A 
T1  - Tin/indium nanobundle formation from aggregation or growth of nanoparticles.
Y1  - 2008/01/
N1  - R831489
JF  - JOURNAL OF NAONOPARTICLE RESEARCH
VL  - 10
IS  - 1
SP  - 41
EP  - 46
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Xiao, F 
A1  - Moon, K 
A1  - Wong, C P
T1  - Novel curing agent for lead-free electronics: amino acid.
Y1  - 2005/01/15
N1  - R831489
JF  - JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
J1  - J POLYM SCI POL CHEM
VL  - 44
IS  - 2
SP  - 1020
EP  - 1027
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Materials science. Electronics without lead.
Y1  - 2005/06/
N1  - R831489
JF  - SCIENCE
J1  - SCIENCE
VL  - 308
IS  - 5727
SP  - 1419
EP  - 1420
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives.
Y1  - 2005/03/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 3
SP  - 266
EP  - 271
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: electrical and thermal properties.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 12
SP  - 1573
EP  - 1578
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Reliability improvement of conductive adhesives on tin (Sn) surfaces.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
J1  - J ADHES SCI TECHNOL
VL  - 19
IS  - 16
SP  - 1427
EP  - 1444
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Whitman, A 
A1  - Wong, C P
T1  - Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes.
Y1  - 2006/12/
N1  - R831489
JF  - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
J1  - IEEE T COMPON PACK T
VL  - 29
IS  - 4
SP  - 758
EP  - 763
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering.
Y1  - 2006/02/
N1  - R831489
JF  - JOURNAL OF APPLIED POLYMER SCIENCE
J1  - J APPL POLYM SCI
VL  - 99
IS  - 4
SP  - 1665
EP  - 1673
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Wong, C P
T1  - Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications.
Y1  - 2006/01/30
N1  - R831489
JF  - MATERIALS SCIENCE AND ENGINEERING: R: REPORTS
J1  - NONE
VL  - 51
IS  - 1-3
SP  - 1
EP  - 35
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Electrical property improvement of electrically conductive adhesives through <em>in-situ</em> replacement by short-chain difunctional acids.
Y1  - 2006/03/
N1  - R831489
JF  - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
J1  - IEEE T COMPON PACK T
VL  - 29
IS  - 1
SP  - 173
EP  - 178
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Wong, C P
T1  - Monolayer protection for eletrochemical migration control in silver nanocomposite.
Y1  - 2006/09/12
N1  - R831489
JF  - APPLIED PHYSICS LETTERS
J1  - APPL PHYS LETT
VL  - 89
IS  - 11
SP  - 112112
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Wong, C P
T1  - High performance anisotropic conductive adhesives for lead-free interconnects.
Y1  - 2006//
N1  - R831489
JF  - SOLDERING &AMP; SURFACE MOUNT TECHNOLOGY
VL  - 18
IS  - 2
SP  - 33
EP  - 39
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Xiao, F 
A1  - Wong, C P
T1  - Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy.
Y1  - 2007/01/15
N1  - R831489
JF  - JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY
VL  - 45
IS  - 2
SP  - 181
EP  - 190
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Yim, M J
A1  - Wong, C P
T1  - High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications.
Y1  - 2007/05/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 36
IS  - 5
SP  - 549
EP  - 554
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K S
A1  - Wong, C P
T1  - Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect.
Y1  - 2009/02/
N1  - R831489
VL  - 32
IS  - 1
SP  - 123
EP  - 129
ER  - 


TY  - JOUR
A1  - Moon, K 
A1  - Li, Y 
A1  - Xu, J W
A1  - Wong, C P
T1  - Lead-free interconnect technique by using variable frequency microwave.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 7
SP  - 1081
EP  - 1088
ER  - 


TY  - JOUR
A1  - Moon, K 
A1  - Dong, H 
A1  - Maric, R 
A1  - Pothukuchi, S 
A1  - Hunt, A 
A1  - Li, Y 
A1  - Wong, C P
T1  - Thermal behavior of silver nanoparticles for low-temperature interconnect applications.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 2
SP  - 168
EP  - 175
ER  - 


TY  - JOUR
A1  - Yim, M J
A1  - Li, Y 
A1  - Moon, K S
A1  - Wong, C P
T1  - Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives.
Y1  - 2007/10/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 36
IS  - 10
SP  - 1341
EP  - 1347
ER  - 


TY  - JOUR
A1  - Yim, M J
A1  - Li, Y 
A1  - Moon, K 
A1  - Paik, K W
A1  - Wong, C P
T1  - Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging.
Y1  - 2008//
N1  - R831489
JF  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
J1  - J ADHES SCI TECHNOL
VL  - 22
IS  - 14
SP  - 1593
EP  - 1630
ER  - 


TY  - PAT
A1  - Wong, C P
A1  - Rao, Y 
T1  - High dielectric constant nano-structure polymer-ceramic composite.
Y1  - 2003/04/
N1  - R831489
ER  - 


TY  - PAT
A1  - Zhu, L 
A1  - Wong, C P
T1  - Aligned carbon nanotubes and method for construction thereof.
Y1  - 2008/04/17
N1  - R831489
ER  - 


TY  - CONF
A1  - Dong, H 
A1  - Fan, L 
A1  - Moon, K S
A1  - Wong, C P
A1  - Baskes, M I
T1  - Molecular dynamics simulation of lead free solder for low temperature reflow applications.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K S
A1  - Wong, C P
T1  - Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K S
A1  - Zhu, L 
A1  - Lu, J 
A1  - Wong, C P
T1  - The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Tin/silver/copper alloy nanoparticles pastes for low temperature lead-free interconnect applications.
Y1  - 2008/05/27-30
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K 
A1  - Zhang, R 
A1  - Wong, C P
T1  - <em>In situ</em> reduced silver nanoparticles for highly conductive anisotropic conductive films applications.
Y1  - 2008//
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Yim, M 
A1  - Moon, K 
A1  - Li, Y 
A1  - Wong, C P
T1  - Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects.
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Whitman, A 
A1  - Moon, K 
A1  - Wong, C P
T1  - High performance electrically conductive adhesives (ECAs) modified with novel aldehydes.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - Nano-Ag filled anisotropic conductive adhesives (ACA) with self-assembled monolayer for high performance fine pitch interconnect.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Stabilizing contact resistance of conductive adhesives on Sn Surface by novel corrosion inhibitors.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Yim, M 
A1  - Moon, K S
A1  - Wong, C P
T1  - High performance non-conductive film (NCF) with conjugated molecular wires.
Y1  - 2007//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - Amino acid as a novel curing agent for epoxy in electronic materials [#227 in Nanotechnology and the Environment (I&amp;EC)].
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - Effects of surface chelating on corrosion control in electronic packaging [#198 in Advanced Materials for Microelectronic Packaging (I&amp;EC)].
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - High performance environmental friendly nano-composite for lead-free interconnect [#515 in Polymers in Microelectronics and Optoelectronics (PMSE)].
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Improvement of electrical performance of anisotropically conductive adhesives (ACA).
N1  - R831489
ER  - 


TY  - CONF
A1  - Zhang, R W
A1  - Moon, K S
A1  - Lin, W 
A1  - Jiang, H J
A1  - Wong, C P
T1  - Incorporation of self-assembly molecular wires into anisotropic conductive adhesive for high performance interconnection applications.
Y1  - 2008/12/
N1  - R831489
ER  - 


TY  - CONF
A1  - Zhang, R W
A1  - Wei, W 
A1  - Moon, K S
A1  - Jiang, H J
A1  - Lin, W 
A1  - Wong, C P
T1  - Development of transparent and flexible electrically conductive adhesives for microelectronics applications.
Y1  - 2008//
N1  - R831489
ER  - 


TY  - CONF
A1  - Zhang, R 
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Electrically conductive adhesive with pi-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties.
Y1  - 2008/05/27
N1  - R831489
ER  - 


TY  - CONF
A1  - Dong, H 
A1  - Fan, L 
A1  - Moon, K 
A1  - Wong, C P
A1  - et, A L
T1  - Dynamics simulation of lead free solder for low temperature applications.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K 
A1  - Zhu, L 
A1  - Lu, J 
A1  - et, A L
T1  - Role of self-assembled monolayer (SAM) on Ag nanoparticles for nanocomposite.
Y1  - 2005/03/
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Synthesis of Ag-Cu nanoparticles for lead-free interconnect materials.
Y1  - 2005/03/
N1  - R831489
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K 
A1  - Li, Y 
A1  - Wong, C P
T1  - Ultra high conductivity of isotropic conductive adhesives.
Y1  - 2006/07/05
N1  - R831489
VL  - 990
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Zhu, L 
A1  - Moon, K 
A1  - Li, Y 
A1  - Wong, C 
T1  - Low temperature carbon nanotube film transfer via conductive adhesives
Y1  - 2007/06/27
N1  - R831489
JF  - 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Yim, M J
A1  - Moon, K 
A1  - Wong, C P
T1  - Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects.
Y1  - 2008/05/27-30
N1  - R831489
SP  - 1385
EP  - 1389
ER  - 


TY  - CONF
A1  - Jiang, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications.
Y1  - 2008/05/27-30
N1  - R831489
SP  - 1400
EP  - 1404
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Stabilizing contact resistance of adhesives on Sn surface by novel corrosion inhibitors.
Y1  - 2005/03/
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Whitman, A 
A1  - Moon, K 
A1  - Wong, C P
T1  - High performance electrically conductive adhesives (ECAs) modified with novel aldehydes.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Improvement of electrical performance anisotropically conductive adhesives (ACA).
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - Nano-Ag filled anisotropic conductive adhesives with self-assembled monolayer for high performance fine pitch.
Y1  - 2005//
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Effects of reducing agents on the electrical properties of electrically conductive adhesives.
Y1  - 2006/08/07
N1  - R831489
SP  - 179
EP  - 183
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - Silver migration control in electrically conductive adhesives.
Y1  - 2006/10/09
N1  - R831489
SP  - 206
EP  - 212
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Yim, M 
A1  - Moon, K 
A1  - Wong, C 
T1  - High performance nano-scale conductive films with low temperature sintering for fine pitch electronic interconnect
Y1  - 2007/08/08
N1  - R831489
JF  - PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION
SP  - 1
EP  - 7
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K 
A1  - Wong, C P
T1  - Nano-scale conductive films with low temperature sintering for high performance fine pitch interconnect.
Y1  - 2007/05/01
N1  - R831489
SP  - 1350
EP  - 1355
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Yim, M J
A1  - Wong, C P
T1  - Novel monolayer-enhanced non-conductive film (NCF) for ultra-fine pitch high performance interconnect in lead-free electronics.
Y1  - 2007/05/
N1  - R831489
SP  - 1911
EP  - 1915
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K 
A1  - Zhang, R W
A1  - Wong, C P
T1  - Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications.
Y1  - 2008/05/27-30
N1  - R831489
SP  - 1272
EP  - 1276
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Xiao, F 
A1  - Moon, K 
A1  - Wong, C P
T1  - A novel environmentally friendly and biocompatible curing agent for lead-free electronics.
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - A novel non-migration nano-Ag conductive adhesive with enhanced electrical and thermal properties via self-assembled monolayers modification.
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Wong, C P
T1  - High performance conductive adhesives for lead-free interconnects.
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Novel lead free nano-scale non-conductive adhesive (NCA) for ultra-fine pitch interconnect applications.
N1  - R831489
ER  - 


TY  - CONF
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications.
N1  - R831489
ER  - 


TY  - CONF
A1  - Yim, M J
A1  - Li, Y 
A1  - Moon, K S
A1  - Wong, C P
T1  - Oxidation prevention and electrical property enhancements of copper-filled electrically conductive adhesives for electronic packaging and interconnection.
Y1  - 2007/05/
N1  - R831489
SP  - 82
EP  - 88
ER  - 


TY  - CONF
A1  - Zhang, R W
A1  - Wong, C P
T1  - Advanced interconnect materials for ink-jet printing by low temperature sintering.
Y1  - 2009/05/26-29
N1  - R831489
SP  - 150
EP  - 154
ER  - 


TY  - CONF
A1  - Zhang, R W
A1  - Moon, K S
A1  - Lin, W 
A1  - Wong, C P
T1  - Electrical properties of ACA joints assisted by conjugated molecular wires.
Y1  - 2009/05/26-29
N1  - R831489
SP  - 2034
EP  - 2038
ER  - 


TY  - CONF
A1  - Zhang, R W
A1  - Duan, Y Q
A1  - Lin, W 
A1  - Moon, K S
A1  - Wong, C P
T1  - New electrically conductive adhesives (ECAs) for flexible interconnect applications.
Y1  - 2009/05/26-29
N1  - R831489
SP  - 1356
EP  - 1360
ER  - 


TY  - CONF
A1  - Zhang, R 
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K S
A1  - Lu, D D
A1  - Wong, C P
T1  - Electrically conductive adhesive with π-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties.
N1  - R831489
SP  - 1913
EP  - 1918
ER  -