TY  - THES
T1  - Synthesis and characterization of low-melting temperature lead-free tin/indium (Sn/In) nanosphere particles through the polyol method.
Y1  - 2018/05/
N1  - SU835938
ER  - 


TY  - THES
T1  - Effect of tin-indium nanoparticle additions to the thermal properties and intermetallic compounds of tin-silver-copper composite solder paste.
Y1  - 2019/08/
N1  - SU835938
ER  - 


TY  - THES
T1  - synthesis and characterization of novel Pb-free nanocomposite solder pastes for electronics assembly and packaging.
N1  - SU835938
ER  - 


TY  - JOUR
A1  - Wernicki, E 
A1  - Fratto, E 
A1  - Shu, Y 
A1  - Gao, F 
A1  - Gu, Z 
T1  - Micro-scale solder joints between Cu-Cu wires formed by nanoparticle enabled lead-free solder pastes.
Y1  - 2016/05/
N1  - SU835938
JF  - IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
SP  - 1203
EP  - 1208
ER  - 


TY  - CONF
A1  - Fratto, E 
A1  - Wernicki, E 
A1  - Shu, Y 
A1  - Wang, J 
A1  - Gao, F 
A1  - Gu, Z 
T1  - Green nanosolder paste for next-generation electronics assembly and manufacturing.
Y1  - 015.//
N1  - SU835710
N1  - SU835938
ER  - 


TY  - CONF
A1  - Wang, J 
A1  - Su, J 
A1  - Gao, F 
A1  - Sun, H 
A1  - Gu, Z 
T1  - Magnetic assembly and soldering of multisegment metallic nanowires.
Y1  - 2017//
N1  - SU835938
ER  - 


TY  - CONF
A1  - Wang, J 
A1  - Gao, F 
A1  - Li, Z 
A1  - Gu, Z 
T1  - Synthesis and nano-joining of multi-segmented metallic nanowire.
N1  - SU835938
ER  - 


TY  - CONF
A1  - Wernicki, E 
A1  - Gao, F 
A1  - Morose, G 
A1  - Gu, Z 
T1  - Development of Pb-free and halogen-free nanosolder paste for electronics assembly and packaging.
Y1  - 015.//
N1  - SU835710
N1  - SU835938
ER  - 


TY  - CONF
A1  - Wernicki, E 
A1  - Fratto, E 
A1  - Shu, Y 
A1  - Gao, F 
A1  - Gu, Z 
T1  - Micro-scale Cu-Cu wire joining via lead-free nanosolder pastes.
Y1  - 016.//
N1  - SU835938
ER  - 


TY  - CONF
A1  - Wernicki, E 
A1  - Fratto, E 
A1  - Shu, Y 
A1  - Gao, F 
A1  - Gu, Z 
T1  - Micro-scale solder joints between Cu-Cu wires formed by nanoparticle enabled lead-free solder pastes.
Y1  - 016.//
N1  - SU835938
ER  - 


TY  - CONF
T1  - Development of Pb-free and halogen-free nanosolder paste for electronics assembly and packaging.
Y1  - 015.//
N1  - SU835710
N1  - SU835938
ER  - 


TY  - CONF
T1  - Nanoparticle-enhanced lead-free solder pastes for electronics assembly and packaging.
Y1  - 2016//
N1  - SU835938
ER  - 


TY  - CONF
T1  - Electrodeposition of multi-segment metallic nanowires and their self-assembling applicaitons.
Y1  - 2017//
N1  - SU835938
ER  - 


TY  - CONF
T1  - Soldering of self-assembled multisegment metallic nanowires and their applications.
Y1  - 2017//
N1  - SU835938
ER  - 


TY  - CONF
T1  - Investigation of melting behavior and morphology change of Sn nanowires based on infra-red (IR) heating method.
N1  - SU835938
ER  - 


TY  - CONF
T1  - Infrared (IR) soldering of metallic nanowires.
Y1  - 2017/05/
N1  - SU835938
SP  - 2175
EP  - 2180
ER  -