Publications Details for:

Dry Lithography: Environmentally Responsible Processes for High Resolution Pattern Transfer and Elimination of Image Collapse using Positive Tone Resists
Grant Number R829586
RFA: Technology for a Sustainable Environment (2001)
Abstract (9)
Conference Proceedings (3)
Patent/Patent Application (6)
Presentation (3)
Proceedings (1)
Reference Type Reference Title Journal Author Citation Progress Report Year Document Sources
Abstract Alicyclic photoresists for CO2-based microlithography at 157 nm. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY Boggiano MK, DeSimone J Boggiano MK, DeSimone J. Alicyclic photoresists for CO2-based microlithography at 157 nm. Abstracts of Papers of the American Chemical Society 2002;224(Pt 2):149-PMSE. R829586 (Final)
Abstract Alicyclic photoresists for CO2-based microlithography at 157 nm. POLYMERIC MATERIALS SCIENCE AND ENGINEERING Boggiano MK, DeSimone J Boggiano MK, DeSimone J. Alicyclic photoresists for CO2-based microlithography at 157 nm. American Chemical Society Polymeric Materials Science and Engineering Preprints 2002;87:207-208. R829586 (Final)
Abstract Photoresists for CO2-based next-generation microlithography. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY Boggiano MK, DeSimone JM Boggiano MK, DeSimone JM. Photoresists for CO2-based next-generation microlithography. Abstracts of Papers of the American Chemical Society 2005;229(Pt 2):83-PMSE. R829586 (Final)
Abstract Photoresists for CO2-based next-generation microlithography. POLYMERIC MATERIALS SCIENCE AND ENGINEERING Boggiano MK, DeSimone JM Boggiano MK, DeSimone JM. Photoresists for CO2-based next-generation microlithography. American Chemical Society Polymeric Materials Science and Engineering Preprints 2005;92:140-141. R829586 (Final)
Abstract Use of "dry" CO2-based technologies for the enhanced fabrication of microelectronic devices. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY Denison GM, Jones CA, DeYoung J, Gross SM, McClain J, Zannoni LA, Hicks E, Wood CD, Boggiano MK, Visintin PM, Bessel CA, Schauer CK, DeSimone JM Denison GM, Jones CA, DeYoung J, Gross SM, McClain J, Zannoni LA, Hicks E, Wood CD, Boggiano MK, Visintin PM, Bessel CA, Schauer CK, DeSimone JM. Use of "dry" CO2-based technologies for the enhanced fabrication of microelectronic devices. Abstracts of Papers of the American Chemical Society 2004;227(Pt 2):89-PMSE. R829586 (Final)
Abstract Use of "dry" CO2-based technologies for the enhanced fabrication of microelectronic devices. POLYMERIC MATERIALS SCIENCE AND ENGINEERING Denison GM, Jones CA, DeYoung J, Gross SM, McClain J, Zannoni LA, Hicks E, Wood CD, Boggiano MK, Visintin PM, Bessel CA, Schauer CK, DeSimone JM Denison GM, Jones CA, DeYoung J, Gross SM, McClain J, Zannoni LA, Hicks E, Wood CD, Boggiano MK, Visintin PM, Bessel CA, Schauer CK, DeSimone JM. Use of "dry" CO2-based technologies for the enhanced fabrication of microelectronic devices. American Chemical society, Division of Polymeric Materials Science and Engineering Preprints 2004;90:152-153. R829586 (Final)
Abstract Rational fabrication of polymeric nanostructures using soft lithography. POLYMER PREPRINTS Maynor BW, Rolland JP, Exner AE, DeSimone JM Maynor BW, Rolland JP, Exner AE, DeSimone JM. Rational fabrication of polymeric nanostructures using soft lithography. American Chemical Society, Polymer Preprints 2005;46:82. R829586 (Final)
Abstract New fluoropolymers for next generation photolithographic techniques. POLYMERIC MATERIALS SCIENCE AND ENGINEERING Wood CD, DeSimone JM Wood CD, DeSimone JM. New fluoropolymers for next generation photolithographic techniques. American Chemical Society Polymeric Materials Science and Engineering Preprints 2005;92:133. R829586 (Final)
Abstract Synthesis, characterization, and properties of copolymers prepared in dense carbon dioxide towards the development of a 157 nm photoresist. POLYMERIC MATERIALS SCIENCE AND ENGINEERING PREPRINTS Zannoni LA, DeSimone JM Zannoni LA, DeSimone JM. Synthesis, characterization, and properties of copolymers prepared in dense carbon dioxide towards the development of a 157 nm photoresist. American Chemical Society Polymeric Materials Science and Engineering Preprints 2002;87:197-198. R829586 (2002)
R829586 (Final)
Conference Proceedings Alicyclic photoresists for CO2-based microlithography at 157 nm. None Boggiano MK, DeSimone JM Boggiano MK, DeSimone JM. Alicyclic photoresists for CO2-based microlithography at 157 nm. In: Proceedings of the SPIE 5039, Advances in Resist Technology and Processing XX, Santa Clara, CA, February 23, 2003, pp. 650-654. R829586 (Final)
Conference Proceedings Synthesis of photoresists for 157 nm microlithography using CO2. None Boggiano MK, DeSimone JM Boggiano MK, DeSimone JM. Synthesis of photoresists for 157 nm microlithography using CO2. In: Proceedings of the SPIE 5376, Advances in Resist Technology and Processing XXI, Santa Clara, CA, February 22, 2004, pp. 549-553. R829586 (Final)
Conference Proceedings Photoresists for CO2-based next-generation microlithography. None Boggiano MK, Wood CD, DeSimone JM Boggiano MK, Wood CD, DeSimone JM. Photoresists for CO2-based next-generation microlithography. In:Sturtevant JL, ed. Proceedings of the SPIE Volume 5753, Advances in Resist Technology and Processing XXII, San Jose, CA, February 27-March 4, 2005, pp. 487-490. R829586 (Final)
Patent/Patent Application Isolated and fixed micro and nano structures and methods thereof. None DeSimone JM, Denison Rothrock G DeSimone JM, Denison Rothrock G. Isolated and fixed micro and nano structures and methods thereof. U.S. Patent Application No. 20070264481 A1, November 15, 2007. R826115 (Final)
R829586 (Final)
Patent/Patent Application Micro- and nano-structure metrology. None DeSimone JM, Rothrock GD DeSimone JM, Rothrock GD. Micro-and nano-structure metrology. U.S. Patent Application No. 20090304992 A1, December 10, 2009. R826115 (Final)
R829586 (Final)
Patent/Patent Application Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography None DeSimone JM, Rolland JP, Maynor BW, Euliss LE, Rothrock GD, Dennis A, Samulski ET, Samulski RJ DeSimone JM, Rolland JP, Maynor BW, Euliss LE, Rothrock GD, Dennis A, Samulski ET, Samulski RJ. Methods for fabricating isolated micro- and nano-structures using soft or imprint lithography. U.S. Patent Application No. 20090061152 A1, March 5, 2009. R826115 (Final)
R829586 (Final)
Patent/Patent Application Thin film of closed-cell foam. None DeSimone JM, Siripurapu S, Khan SA, Spontak RJ, Royer J DeSimone JM, Siripurapu S, Khan SA, Spontak RJ, Royer J. Thin film of closed-cell foam. U.S. Patent No. 7,658,989 B2, February 9, 2010. R826115 (Final)
R829586 (Final)
Patent/Patent Application High fidelity nano-structures and arrays for photovoltaics and methods of making the same. None DeSimone JM, Rothrock GD, Zhou Z, Samulski ET, Hampton M, Williams S DeSimone JM, Rothrock GD, Zhou Z, Samulski ET, Hampton M, Williams S. High fidelity nano-structures and arrays for photovoltaics and methods of making the same. U.S. Patent Application No. 20100147365 A1, June 17, 2010. R826115 (Final)
R829586 (Final)
Patent/Patent Application Methods for fabrication isolated micro- and nano-structures using soft or imprint lithography. None DeSimone JM, Rolland JP, Maynor BW, Euliss LE, Rothrock GD, Dennis AE, Samulski ET, Samulski RJ. DeSimone JM, Rolland JP, Maynor BW, Euliss LE, Rothrock GD, Dennis AE, Samulski ET, Samulski RJ. Methods for fabrication isolated micro- and nano-structures using soft or imprint lithography. U.S. Patent No. 8,420,124, April 16, 2013. R826115 (Final)
R829586 (Final)
Presentation Development of a 157 nm photoresist for CO2 based lithography. None Zannoni LA, DeSimone JM Zannoni LA, DeSimone JM. Development of a 157 nm photoresist for CO2 based lithography. Presented at the Fluoropolymer 2002 Workshop, Savannah, GA, October 13-16, 2002. R829586 (2002)
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Presentation Progress towards the development of a 157 nm photoresist for carbon dioxide based lithography. None Zannoni LA, DeSimone JM Zannoni LA, DeSimone JM. Progress towards the development of a 157 nm photoresist for carbon dioxide based lithography. Presented at the International Society for Optical Engineering Meeting, Santa Clara, CA, February 2003. R829586 (2002)
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Presentation Synthesis, characterization, and properties of copolymers prepared in dense carbon dioxide towards the development of a 157 nm Photoresist. None Zannoni LA, DeSimone JM Zannoni LA, DeSimone JM. Synthesis, characterization, and properties of copolymers prepared in dense carbon dioxide towards the development of a 157 nm Photoresist. Presented at the National Meeting of the American Chemical Society, Boston, MA, August 21, 2002. R829586 (2002)
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Proceedings Progress towards the development of a 157 nm photoresist for carbon dioxide based lithography. None Zannoni LA, Simhan J, DeSimone JM Zannoni LA, Simhan J, DeSimone JM. Progress towards the development of a 157 nm photoresist for carbon dioxide based lithography. In: Fedynyshyn TH, ed. Proceedings of the International Society for Optical Enginering. Advances in Resist Technology and Processing XX. R829586 (2002)
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