Grantee Research Project Results

Final Report: Green Nanosolder Paste for Next-Generation Electronics Assembly and Manufacturing

EPA Grant Number: SU835710
Title: Green Nanosolder Paste for Next-Generation Electronics Assembly and Manufacturing
Investigators: Gu, Zhiyong , Fratto, Edward , Wernicki, Evan , Gao, Fan , Wang, Jirui , Shu, Yang
Institution: University of Massachusetts - Lowell
EPA Project Officer: Hahn, Intaek
Phase: I
Project Period: August 15, 2014 through August 14, 2015
Project Amount: $15,000
RFA: P3 Awards: A National Student Design Competition for Sustainability Focusing on People, Prosperity and the Planet (2014) RFA Text | Recipients Lists
Research Category: Pollution Prevention/Sustainable Development , P3 Awards , P3 Challenge Area - Air Quality , P3 Challenge Area - Chemical Safety , Sustainable and Healthy Communities

Objective:

Nano-soldering is an enabling technology for next generation electronics assembly and manufacturing. As electronic devices are getting smaller, lighter and more powerful, new assembling methods are required to accommodate all electronic parts in a much smaller single device. This proposed study focuses on developing a green lead-free and halogen-free nanosolder paste by using Sn/Ag/Cu (SAC) nanoparticles to replace the conventional solder paste with micron sized solder balls, which contains toxic and hazardous materials including lead or halogen or both in a typical solder paste formulation in current electronics industry.

Summary/Accomplishments (Outputs/Outcomes):

In the past half year (from August 2014 to present), there are several important findings from the research study of lead-free and halogen-free nanosolder paste project:

The lead-free tin/silver/copper (SAC) nanoparticles have been successfully synthesized within the size range of 16 nm-28 nm in diameter.
The SAC305 nanoparticles synthesized above showed a melting temperature depression of 3 degrees compared to the bulk material. This is not significantly low due to its size.
The as synthesized nanoparticles were mixed with commercial halogen-free solder flux and formulated to form a lead-free and halogen-free nanosolder paste.
The formulated halogen-free SAC305 nanosolder paste can be printed on the copper substrate; solder bumps were formed and upon reflowing in a reflow oven.

Conclusions:

By now, we have shown that the proof of concept for lead-free and halogen-free SAC305 nanosolder paste has been confirmed in the lab. Current experimental results showed that the new nanosolder paste can be printed by standard stencil, and reflowed in a mini solder reflow oven following typical reflow profiles. The new nanosolder paste showed promise as a potential replacement for current solder material on the market.

Journal Articles:

No journal articles submitted with this report: View all 3 publications for this project

Supplemental Keywords:

Green chemistry; Environmentally-benign substitute; Energy conservation; Lead-free; Halogen-free; Nanosolder paste; Electronics assembly and packaging

Relevant Websites:

Nano-Solder Research at UMass. Lowell Exit

P3 Phase II:

Green Nanosolder Paste for Next Generation Electronics Assembly and Manufacturing | 2016 Progress Report | 2017 Progress Report | Final Report

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The perspectives, information and conclusions conveyed in research project abstracts, progress reports, final reports, journal abstracts and journal publications convey the viewpoints of the principal investigator and may not represent the views and policies of ORD and EPA. Conclusions drawn by the principal investigators have not been reviewed by the Agency.