Removal of Photoresist and Post-Plasma Etch Sidewall Films Using Superciritical and Subcritical CO2 with AdditivesEPA Grant Number: R829554
Title: Removal of Photoresist and Post-Plasma Etch Sidewall Films Using Superciritical and Subcritical CO2 with Additives
Investigators: Hess, Dennis W.
Current Investigators: Hess, Dennis W. , Levitin, Galit , Myneni, Satya
Institution: Georgia Institute of Technology
EPA Project Officer: Savage, Nora
Project Period: January 1, 2002 through December 31, 2004
Project Amount: $325,000
RFA: Technology for a Sustainable Environment (2001) RFA Text | Recipients Lists
Research Category: Sustainability , Pollution Prevention/Sustainable Development
Description:The overall objective of this research is to investigate the use of environmentally benign approaches for the removal of organic films and residues generated during the fabrication of integrated circuits (ICs) and microelectronic devices.
Approach:The work will focus on the use of supercritical and subcritical carbon dioxide for film and residue removal; appropriate additives and co-solvents to carbon dioxide will be identified and the necessary fluid conditions established. Novel elevated pressure reactors, designed to investigate removal processes based upon carbon dioxide mixtures, will allow detailed information on the interaction of fluids with films/residues. Knowledge of these interactions will be used to establish specific fluid mixtures that permit a more environmentally benign approach to effective organic film and residue removal in IC fabrication.
Expected Results:Results of these studies will allow the design of organic film and residue processes that will minimize the current use of both hazardous chemicals and extensive quantities of de-ionized water.
Publications and Presentations:Publications have been submitted on this project: View all 14 publications for this project
Journal Articles:Journal Articles have been submitted on this project: View all 7 journal articles for this project
Supplemental Keywords:electronics, environmentally conscious manufacturing, engineering., RFA, Scientific Discipline, Sustainable Industry/Business, Chemical Engineering, Environmental Chemistry, cleaner production/pollution prevention, Sustainable Environment, Chemistry, Technology for Sustainable Environment, New/Innovative technologies, Engineering, supercritical carbon dioxide (SCCO2) technology, environmentally conscious manufacturing, environmentally friendly technology, waste minimization, waste reduction, integrated circuit fabrication, organic residues, co-solvents, supercritical carbon dioxide, subcritical CO2, electronics , pollution prevention, organic films
Progress and Final Reports:2002 Progress Report
2003 Progress Report