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Book Chapter (1)
Journal Article (32)
Reference Type Reference Title Journal Author Citation Progress Report Year Document Sources
Book Chapter Electrically conductive adhesives. None Li Y, Yim MJ, Moon K-S, Wong CP Li Y, Yim MJ, Moon K-S, Wong CP. Electrically conductive adhesives. In:Schwartz M, ed. Smart Materials. Boca Raton, FL: CRC Press, 2008, pp. 11-12--11-24. R831489 (Final)
Journal Article Processing and shape effects on silver paste electrically conductive adhesives (ECAs). JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Chiang H-W, Chung C-L, Chen L-C, Li Y, Wong CP, Fu S-L Chiang H-W, Chung C-L, Chen L-C, Li Y, Wong CP, Fu S-L. Processing and shape effects on silver paste electrically conductive adhesives (ECAs). Journal of Adhesion Science and Technology 2005;19(7):565-578. R831489 (2005)
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Journal Article Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. JOURNAL OF ELECTRONIC MATERIALS Dong H, Moon K-S, Wong CP Dong H, Moon K-S, Wong CP. Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. Journal of Electronic Materials 2004;33(11):1326-1330. R831489 (2004)
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Journal Article Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Dong H, Zhang Z, Wong CP Dong H, Zhang Z, Wong CP. Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. Journal of Adhesion Science and Technology 2005;19(2):87-94. R831489 (2004)
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Journal Article MEAM molecular dynamics study of lead free solder for electronic packaging applications. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING Dong H, Fan L, Moon K-S, Wong CP, Baskes MI Dong H, Fan L, Moon K-S, Wong CP, Baskes MI. MEAM molecular dynamics study of lead free solder for electronic packaging applications. Modelling and Simulation in Materials Science and Engineering 2005;13(8):1279. R831489 (Final)
Journal Article Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. JOURNAL OF ELECTRONIC MATERIALS Dong H, Moon K-S, Wong CP Dong H, Moon K-S, Wong CP. Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. Journal of Electronic Materials 2005;34(1):40-45. R831489 (2004)
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Journal Article Magnetic nanocomposite for potential ultrahigh frequency microelectronic application. JOURNAL OF ELECTRONIC MATERIAL Dong H, Meininger A, Jiang H, Moon K-S, Wong CP Dong H, Meininger A, Jiang H, Moon K-S, Wong CP. Magnetic nanocomposite for potential ultrahigh frequency microelectronic application. Journal of Electronic Materials 2007;36(5):593-597. R831489 (2007)
Journal Article Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. APPLIED PHYSICS LETTERS Dong H, Li Y, Yim MJ, Moon KS, Wong CP Dong H, Li Y, Yim MJ, Moon KS, Wong CP. Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. Applied Physics Letters 2007;90(9):092102 (3 pp.). R831489 (2006)
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Journal Article Variable frequency microwave synthesis of silver nanoparticles. JOURNAL OF NANOPARTICLE RESEARCH Jiang HJ, Moon K-S, Zhang ZQ, Pothukuchi S, Wong CP Jiang HJ, Moon K-S, Zhang ZQ, Pothukuchi S, Wong CP. Variable frequency microwave synthesis of silver nanoparticles. Journal of Nanoparticle Research 2006;8(1):117-124. R831489 (2004)
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Journal Article Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. JOURNAL OF ELECTRONIC MATERIALS Jiang H, Moon K-S, Lu J, Wong CP Jiang H, Moon K-S, Lu J, Wong CP. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. Journal of Electronic Materials 2005;34(11):1432-1439. R831489 (2005)
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Journal Article Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. CHEMISTRY OF MATERIALS Jiang H, Moon K-S, Li Y, Wong CP Jiang H, Moon K-S, Li Y, Wong CP. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chemistry of Materials 2006;18(13):2969-2973. R831489 (2006)
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Journal Article Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. CHEMISTRY OF MATERIALS Jiang H, Moon K-S, Hua F, Wong CP Jiang H, Moon K, Hua F, Wong CP. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. Chemistry of Materials 2007;19(18):4482-4485. R831489 (2007)
Journal Article Low temperature carbon nanotube film transfer via conductive polymer composites. NANOTECHNOLOGY Jiang H, Zhu L, Moon K-S, Wong CP Jiang H, Zhu L, Moon K-S, Wong CP. Low temperature carbon nanotube film transfer via conductive polymer composites. Nanotechnology 2007;18(12):125203 (4 pp.). R831489 (Final)
Journal Article The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production. CARBON Jiang H, Zhu L, Moon K-S, Wong CP Jiang H, Zhu L, Moon K-S, Wong CP. The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production. Carbon 2007;45(3):655-661. R831489 (2007)
Journal Article Tin/indium nanobundle formation from aggregation or growth of nanoparticles. JOURNAL OF NAONOPARTICLE RESEARCH Jiang H, Moon K-S, Sun Y, Wong CP, Hua F, Pal T, Pal A Jiang H, Moon K-S, Sun Y, Wong CP, Hua F, Pal T, Pal A. Tin/indium nanobundle formation from aggregation or growth of nanoparticles. Journal of Naonoparticle Research 2008;10(1):41-46. R831489 (Final)
Journal Article Novel curing agent for lead-free electronics: amino acid. JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY Li Y, Xiao F, Moon K-S, Wong CP Li Y, Xiao F, Moon K-S, Wong CP. Novel curing agent for lead-free electronics: amino acid. Journal of Polymer Science Part A: Polymer Chemistry 2006;44(2):1020-1027. R831489 (2005)
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Journal Article Materials science. Electronics without lead. SCIENCE Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Materials science. Electronics without lead. Science 2005;308(5727):1419-1420. R831489 (2005)
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Journal Article Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. JOURNAL OF ELECTRONIC MATERIALS Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Journal of Electronic Materials 2005;34(3):266-271. R831489 (2005)
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Journal Article Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: electrical and thermal properties. JOURNAL OF ELECTRONIC MATERIALS Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Monolayer-protected silver nano-particle-based anisotropic conductive adhesives:electrical and thermal properties. Journal of Electronic Materials 2005;34(12):1573-1578. R831489 (2005)
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Journal Article Reliability improvement of conductive adhesives on tin (Sn) surfaces. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Reliability improvement of conductive adhesives on tin (Sn) surfaces. Journal of Adhesion Science and Technology 2005;19(16):1427-1444. R831489 (2005)
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Journal Article Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Li Y, Moon K-S, Whitman A, Wong CP Li Y, Moon K-S, Whitman A, Wong CP. Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE Transactions on Components and Packaging Technologies 2006;29(4):758-763. R831489 (2006)
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Journal Article Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. JOURNAL OF APPLIED POLYMER SCIENCE Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. Journal of Applied Polymer Science 2006;99(4):1665-1673. R831489 (2005)
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Journal Article Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. MATERIALS SCIENCE AND ENGINEERING: R: REPORTS Li Y, Wong CP Li Y, Wong CP. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Materials Science and Engineering R: Reports 2006;51(1-3):1-35. R831489 (2005)
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Journal Article Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Transactions on Components and Packaging Technologies 2006;29(1):173-178. R831489 (2005)
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Journal Article Monolayer protection for eletrochemical migration control in silver nanocomposite. APPLIED PHYSICS LETTERS Li Y, Wong CP Li Y, Wong CP. Monolayer protection for eletrochemical migration control in silver nanocomposite. Applied Physics Letters 2006;89(11):112112. R831489 (2006)
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Journal Article High performance anisotropic conductive adhesives for lead-free interconnects. SOLDERING & SURFACE MOUNT TECHNOLOGY Li Y, Wong CP Li Y, Wong CP. High performance anisotropic conductive adhesives for lead-free interconnects. Soldering & Surface Mount Technology 2006;18(2)33-39. R831489 (2006)
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Journal Article Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY Li Y, Xiao F, Wong CP Li Y, Xiao F, Wong CP. Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. Journal of Polymer Science Part A: Polymer Chemistry 2007;45(2):181-190. R831489 (2006)
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Journal Article High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. JOURNAL OF ELECTRONIC MATERIALS Li Y, Yim MJ, Wong CP Li Y, Yim MJ, Wong CP. High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. Journal of Electronic Materials 2007;36(5):549-554. R831489 (2007)
Journal Article Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. None Li Y, Yim MJ, Moon KS, Wong CP Li Y, Yim MJ, Moon KS, Wong CP. Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. IEEE Transactions on Advanced Packaging 2009;32(1):123-129. R831489 (Final)
Journal Article Lead-free interconnect technique by using variable frequency microwave. JOURNAL OF ELECTRONIC MATERIALS Moon K-S, Li Y, Xu JW, Wong CP Moon K-S, Li Y, Xu JW, Wong CP. Lead-free interconnect technique by using variable frequency microwave. Journal of Electronic Materials 2005;34(7):1081-1088. R831489 (2004)
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Journal Article Thermal behavior of silver nanoparticles for low-temperature interconnect applications. JOURNAL OF ELECTRONIC MATERIALS Moon K-S, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP Moon K-S, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP. Thermal behavior of silver nanoparticles for low-temperature interconnect applications. Journal of Electronic Materials 2005;34(2):168-175. R831489 (2005)
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Journal Article Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. JOURNAL OF ELECTRONIC MATERIALS Yim MJ, Li Y, Moon KS, Wong CP Yim MJ, Li Y, Moon KS, Wong CP. Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. Journal of Electronic Materials 2007;36(10):1341-1347. R831489 (2007)
Journal Article Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Yim MJ, Li Y, Moon K-S, Paik KW, Wong CP Yim MJ, Li Y, Moon K-S, Paik KW, Wong CP. Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. Journal of Adhesion Science and Technology 2008;22(14):1593-1630. R831489 (Final)

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