TY - CHAP
A1 - Myneni, S
A1 - Hess, D W
T1 - Fluorocarbon film and residue removal using supercrital CO2 mixtures.
Y1 - 2002//
N1 - R829554
SP - 180
EP - 189
PB - The Electrochemical Scoiety
ER -
TY - JOUR
A1 - Levitin, G
A1 - Myneni, S
A1 - Hess, D W
T1 - Reactions between CO2 and tetramethylammonium hydroxide in cleaning solutions.
Y1 - 2003//
N1 - R829554
JF - ELECTROCHEMICAL AND SOLID STATE LETTERS
J1 - ELECTROCHEM SOLID ST
VL - 6
IS - 8
SP - G101
EP - G104
ER -
TY - JOUR
A1 - Levitin, G
A1 - Bush, D
A1 - Eckert, C A
A1 - Hess, D W
T1 - Phase behavior and modeling of CO2/methanol/tetramethylammonium bicarbonate and O2/methanol/tetramethylammonium bicarbonate/water mixtures at high pressures.
Y1 - 2004//
N1 - R829554
JF - JOURNAL OF CHEMICAL ENGINEERING & DATA
VL - 49
IS - 3
SP - 599
EP - 606
ER -
TY - JOUR
A1 - Levitin, G
A1 - Myneni, S
A1 - Hess, D W
T1 - Post plasma etch residue removal using CO2-TMAHCO(3) mixtures: Comparison of single-phase and two-phase mixtures
Y1 - 2004//
N1 - R829554
JF - JOURNAL OF THE ELECTROCHEMICAL SOCIETY
J1 - J ELECTROCHEM SOC
VL - 151
IS - 6
SP - G380
EP - G386
ER -
TY - JOUR
A1 - Levitin, G
A1 - Hess, D W
T1 - Ionic conductivity of elevated pressure TMAHCO(3)/MeOH/CO2 mixtures
Y1 - 2005//
N1 - R829554
JF - ELECTROCHEMICAL AND SOLID STATE LETTERS
J1 - ELECTROCHEM SOLID ST
VL - 8
IS - 1
SP - G23
EP - G26
ER -
TY - JOUR
A1 - Myneni, S
A1 - Hess, D W
T1 - Post-plasma-etch residue removal using CO2-based fluids
Y1 - 2003//
N1 - R829554
JF - JOURNAL OF THE ELECTROCHEMICAL SOCIETY
J1 - J ELECTROCHEM SOC
VL - 150
IS - 12
SP - G744
EP - G750
ER -
TY - JOUR
A1 - Myneni, S
A1 - Peng, H-G
A1 - Gidley, D W
A1 - Hess, D W
T1 - Compatibility of High Pressure Cleaning Mixtures with a Porous Low Dielectric Constant Film: A positronium Annihilation Lifetime Spectroscopic Study.
Y1 - 2005//
N1 - R829554
JF - JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
J1 - J VAC SCI TECHNOL B
VL - .23(4)
SP - 1463
ER -
TY - JOUR
A1 - Myneni, S
A1 - Hess, D W
T1 - Post plasma etch residue removal using CO2-based mixtures: Mechanistic considerations
Y1 - 2005//
N1 - R829554
JF - JOURNAL OF THE ELECTROCHEMICAL SOCIETY
J1 - J ELECTROCHEM SOC
VL - 152
IS - 10
ER -
TY - CONF
A1 - Hess, D W
A1 - Levitin, G
A1 - Myneni, S
T1 - Carbon dioxide based fluids for post plasma etch residue removal in integrated circuit (IC) fabrication.
Y1 - 2003/06/
N1 - R829554
ER -
TY - CONF
A1 - Levitin, G
A1 - Myneni, S
A1 - Hess, D W
T1 - Impact of phase behavior on photoresist removal using CO2 based mixtures.
Y1 - 2003/10/
N1 - R829554
ER -
TY - CONF
A1 - Levitin, G
A1 - Myneni, S
A1 - Hess, D W
T1 - Super- and sub-critical CO2-based cleaning in BEOL processing: correlations between physical properties of cleaning mixtures and removal mechanism.
Y1 - 2004/05/7
N1 - R829554
ER -
TY - CONF
A1 - Myneni, S
A1 - Hess, D W
T1 - Fluorocarbon film and residue removal using supercritical CO2 mixtures.
N1 - R829554
ER -
TY - CONF
A1 - Levitin, G
A1 - Myneni, S
A1 - Hess, D W
T1 - Impact of phase behavior on photoresist removal using CO2 based mixtures.
N1 - R829554
ER -
TY - CONF
A1 - Myneni, S
A1 - Hess, D W
T1 - Fluorocarbon film and residue removal using supercritical CO2 mixtures.
Y1 - 2002//
N1 - R829554
ER -