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Book Chapter (1)
Journal Article (32)
Patent/Patent Application (2)
Presentation (18)
Proceedings (28)
Reference Type Reference Title Journal Author Citation Progress Report Year Document Sources
Book Chapter Electrically conductive adhesives. None Li Y, Yim MJ, Moon K-S, Wong CP Li Y, Yim MJ, Moon K-S, Wong CP. Electrically conductive adhesives. In:Schwartz M, ed. Smart Materials. Boca Raton, FL: CRC Press, 2008, pp. 11-12--11-24. R831489 (Final)
Journal Article Processing and shape effects on silver paste electrically conductive adhesives (ECAs). JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Chiang H-W, Chung C-L, Chen L-C, Li Y, Wong CP, Fu S-L Chiang H-W, Chung C-L, Chen L-C, Li Y, Wong CP, Fu S-L. Processing and shape effects on silver paste electrically conductive adhesives (ECAs). Journal of Adhesion Science and Technology 2005;19(7):565-578. R831489 (2005)
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Journal Article Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. JOURNAL OF ELECTRONIC MATERIALS Dong H, Moon K-S, Wong CP Dong H, Moon K-S, Wong CP. Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. Journal of Electronic Materials 2004;33(11):1326-1330. R831489 (2004)
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Journal Article Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Dong H, Zhang Z, Wong CP Dong H, Zhang Z, Wong CP. Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. Journal of Adhesion Science and Technology 2005;19(2):87-94. R831489 (2004)
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Journal Article MEAM molecular dynamics study of lead free solder for electronic packaging applications. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING Dong H, Fan L, Moon K-S, Wong CP, Baskes MI Dong H, Fan L, Moon K-S, Wong CP, Baskes MI. MEAM molecular dynamics study of lead free solder for electronic packaging applications. Modelling and Simulation in Materials Science and Engineering 2005;13(8):1279. R831489 (Final)
Journal Article Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. JOURNAL OF ELECTRONIC MATERIALS Dong H, Moon K-S, Wong CP Dong H, Moon K-S, Wong CP. Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. Journal of Electronic Materials 2005;34(1):40-45. R831489 (2004)
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Journal Article Magnetic nanocomposite for potential ultrahigh frequency microelectronic application. JOURNAL OF ELECTRONIC MATERIAL Dong H, Meininger A, Jiang H, Moon K-S, Wong CP Dong H, Meininger A, Jiang H, Moon K-S, Wong CP. Magnetic nanocomposite for potential ultrahigh frequency microelectronic application. Journal of Electronic Materials 2007;36(5):593-597. R831489 (2007)
Journal Article Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. APPLIED PHYSICS LETTERS Dong H, Li Y, Yim MJ, Moon KS, Wong CP Dong H, Li Y, Yim MJ, Moon KS, Wong CP. Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. Applied Physics Letters 2007;90(9):092102 (3 pp.). R831489 (2006)
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Journal Article Variable frequency microwave synthesis of silver nanoparticles. JOURNAL OF NANOPARTICLE RESEARCH Jiang HJ, Moon K-S, Zhang ZQ, Pothukuchi S, Wong CP Jiang HJ, Moon K-S, Zhang ZQ, Pothukuchi S, Wong CP. Variable frequency microwave synthesis of silver nanoparticles. Journal of Nanoparticle Research 2006;8(1):117-124. R831489 (2004)
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Journal Article Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. JOURNAL OF ELECTRONIC MATERIALS Jiang H, Moon K-S, Lu J, Wong CP Jiang H, Moon K-S, Lu J, Wong CP. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. Journal of Electronic Materials 2005;34(11):1432-1439. R831489 (2005)
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Journal Article Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. CHEMISTRY OF MATERIALS Jiang H, Moon K-S, Li Y, Wong CP Jiang H, Moon K-S, Li Y, Wong CP. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chemistry of Materials 2006;18(13):2969-2973. R831489 (2006)
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Journal Article Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. CHEMISTRY OF MATERIALS Jiang H, Moon K-S, Hua F, Wong CP Jiang H, Moon K, Hua F, Wong CP. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. Chemistry of Materials 2007;19(18):4482-4485. R831489 (2007)
Journal Article Low temperature carbon nanotube film transfer via conductive polymer composites. NANOTECHNOLOGY Jiang H, Zhu L, Moon K-S, Wong CP Jiang H, Zhu L, Moon K-S, Wong CP. Low temperature carbon nanotube film transfer via conductive polymer composites. Nanotechnology 2007;18(12):125203 (4 pp.). R831489 (Final)
Journal Article The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production. CARBON Jiang H, Zhu L, Moon K-S, Wong CP Jiang H, Zhu L, Moon K-S, Wong CP. The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production. Carbon 2007;45(3):655-661. R831489 (2007)
Journal Article Tin/indium nanobundle formation from aggregation or growth of nanoparticles. JOURNAL OF NAONOPARTICLE RESEARCH Jiang H, Moon K-S, Sun Y, Wong CP, Hua F, Pal T, Pal A Jiang H, Moon K-S, Sun Y, Wong CP, Hua F, Pal T, Pal A. Tin/indium nanobundle formation from aggregation or growth of nanoparticles. Journal of Naonoparticle Research 2008;10(1):41-46. R831489 (Final)
Journal Article Novel curing agent for lead-free electronics: amino acid. JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY Li Y, Xiao F, Moon K-S, Wong CP Li Y, Xiao F, Moon K-S, Wong CP. Novel curing agent for lead-free electronics: amino acid. Journal of Polymer Science Part A: Polymer Chemistry 2006;44(2):1020-1027. R831489 (2005)
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Journal Article Materials science. Electronics without lead. SCIENCE Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Materials science. Electronics without lead. Science 2005;308(5727):1419-1420. R831489 (2005)
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Journal Article Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. JOURNAL OF ELECTRONIC MATERIALS Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Journal of Electronic Materials 2005;34(3):266-271. R831489 (2005)
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Journal Article Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: electrical and thermal properties. JOURNAL OF ELECTRONIC MATERIALS Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Monolayer-protected silver nano-particle-based anisotropic conductive adhesives:electrical and thermal properties. Journal of Electronic Materials 2005;34(12):1573-1578. R831489 (2005)
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Journal Article Reliability improvement of conductive adhesives on tin (Sn) surfaces. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Reliability improvement of conductive adhesives on tin (Sn) surfaces. Journal of Adhesion Science and Technology 2005;19(16):1427-1444. R831489 (2005)
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Journal Article Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Li Y, Moon K-S, Whitman A, Wong CP Li Y, Moon K-S, Whitman A, Wong CP. Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE Transactions on Components and Packaging Technologies 2006;29(4):758-763. R831489 (2006)
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Journal Article Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. JOURNAL OF APPLIED POLYMER SCIENCE Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. Journal of Applied Polymer Science 2006;99(4):1665-1673. R831489 (2005)
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Journal Article Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. MATERIALS SCIENCE AND ENGINEERING: R: REPORTS Li Y, Wong CP Li Y, Wong CP. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Materials Science and Engineering R: Reports 2006;51(1-3):1-35. R831489 (2005)
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Journal Article Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Li Y, Moon K-S, Wong CP Li Y, Moon K-S, Wong CP. Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Transactions on Components and Packaging Technologies 2006;29(1):173-178. R831489 (2005)
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Journal Article Monolayer protection for eletrochemical migration control in silver nanocomposite. APPLIED PHYSICS LETTERS Li Y, Wong CP Li Y, Wong CP. Monolayer protection for eletrochemical migration control in silver nanocomposite. Applied Physics Letters 2006;89(11):112112. R831489 (2006)
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Journal Article High performance anisotropic conductive adhesives for lead-free interconnects. SOLDERING & SURFACE MOUNT TECHNOLOGY Li Y, Wong CP Li Y, Wong CP. High performance anisotropic conductive adhesives for lead-free interconnects. Soldering & Surface Mount Technology 2006;18(2)33-39. R831489 (2006)
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Journal Article Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY Li Y, Xiao F, Wong CP Li Y, Xiao F, Wong CP. Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. Journal of Polymer Science Part A: Polymer Chemistry 2007;45(2):181-190. R831489 (2006)
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Journal Article High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. JOURNAL OF ELECTRONIC MATERIALS Li Y, Yim MJ, Wong CP Li Y, Yim MJ, Wong CP. High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. Journal of Electronic Materials 2007;36(5):549-554. R831489 (2007)
Journal Article Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. None Li Y, Yim MJ, Moon KS, Wong CP Li Y, Yim MJ, Moon KS, Wong CP. Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. IEEE Transactions on Advanced Packaging 2009;32(1):123-129. R831489 (Final)
Journal Article Lead-free interconnect technique by using variable frequency microwave. JOURNAL OF ELECTRONIC MATERIALS Moon K-S, Li Y, Xu JW, Wong CP Moon K-S, Li Y, Xu JW, Wong CP. Lead-free interconnect technique by using variable frequency microwave. Journal of Electronic Materials 2005;34(7):1081-1088. R831489 (2004)
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Journal Article Thermal behavior of silver nanoparticles for low-temperature interconnect applications. JOURNAL OF ELECTRONIC MATERIALS Moon K-S, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP Moon K-S, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP. Thermal behavior of silver nanoparticles for low-temperature interconnect applications. Journal of Electronic Materials 2005;34(2):168-175. R831489 (2005)
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Journal Article Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. JOURNAL OF ELECTRONIC MATERIALS Yim MJ, Li Y, Moon KS, Wong CP Yim MJ, Li Y, Moon KS, Wong CP. Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. Journal of Electronic Materials 2007;36(10):1341-1347. R831489 (2007)
Journal Article Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY Yim MJ, Li Y, Moon K-S, Paik KW, Wong CP Yim MJ, Li Y, Moon K-S, Paik KW, Wong CP. Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. Journal of Adhesion Science and Technology 2008;22(14):1593-1630. R831489 (Final)
Patent/Patent Application High dielectric constant nano-structure polymer-ceramic composite. None Wong CP, Rao Y Wong CP, Rao Y. High dielectric constant nano-structure polymer-ceramic composite. U.S. Patent No. 6,544,651, April 8, 2003. R831489 (Final)
Patent/Patent Application Aligned carbon nanotubes and method for construction thereof. None Zhu L, Wong CP Zhu L, Wong CP. Aligned carbon nanotubes and method for construction thereof. U.S. Patent Pending, April 17, 2008. R831489 (Final)
Presentation Molecular dynamics simulation of lead free solder for low temperature reflow applications. None Dong H, Fan L, Moon KS, Wong CP, Baskes MI Dong H, Fan L, Moon KS, Wong CP, Baskes MI. Molecular dynamics simulation of lead free solder for low temperature reflow applications. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. R831489 (2005)
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Presentation Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials. None Jiang H, Moon KS, Wong CP Jiang H, Moon KS, Wong CP. Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials. Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. R831489 (2005)
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Presentation The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite None Jiang H, Moon KS, Zhu L, Lu J, Wong CP Jiang H, Moon KS, Zhu L, Lu J, Wong CP. The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite. Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. R831489 (2005)
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Presentation Tin/silver/copper alloy nanoparticles pastes for low temperature lead-free interconnect applications. None Jiang H, Moon K, Wong CP Jiang H, Moon K, Wong CP. Tin/silver/copper alloy nanoparticles pastes for low temperature lead-free interconnect applications. Presented at the IEEE 58th Electronic Components & Technology Conference, Orlando, FL, May 27-30, 2008. R831489 (2007)
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Presentation In situ reduced silver nanoparticles for highly conductive anisotropic conductive films applications. None Jiang H, Moon K, Zhang R, Wong CP Jiang H, Moon K, Zhang R, Wong CP. In situ reduced silver nanoparticles for highly conductive anisotropic conductive films applications. Presented at the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, August 17-22, 2008. R831489 (Final)
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Presentation Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects. None Jiang H, Yim M, Moon K, Li Y, Wong CP Jiang H, Yim M, Moon K, Li Y, Wong CP. Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects. Presented at the IEEE 58th Electronic Components & Technology Conference, Orlando, FL, May 27-30. R831489 (2007)
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Presentation Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes. None Li Y, Moon K, Wong CP Li Y, Moon K, Wong CP. Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. R831489 (2005)
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Presentation High performance electrically conductive adhesives (ECAs) modified with novel aldehydes. None Li Y, Whitman A, Moon K, Wong CP Li Y, Whitman A, Moon K, Wong CP. High performance electrically conductive adhesives (ECAs) modified with novel aldehydes. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. R831489 (2005)
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Presentation Nano-Ag filled anisotropic conductive adhesives (ACA) with self-assembled monolayer for high performance fine pitch interconnect. None Li Y, Wong CP Li Y, Wong CP. Nano-Ag filled anisotropic conductive adhesives (ACA) with self-assembled monolayer for high performance fine pitch interconnect. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. R831489 (2005)
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Presentation Stabilizing contact resistance of conductive adhesives on Sn Surface by novel corrosion inhibitors. None Li Y, Moon K, Wong CP Li Y, Moon K, Wong CP. Stabilizing contact resistance of conductive adhesives on Sn Surface by novel corrosion inhibitors. Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. R831489 (2005)
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Presentation High performance non-conductive film (NCF) with conjugated molecular wires. None Li Y, Yim M, Moon KS, Wong CP Li Y, Yim M, Moon KS, Wong CP. High performance non-conductive film (NCF) with conjugated molecular wires. Presented at the 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007 (abstract pp. 140-144). R831489 (2007)
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Presentation Amino acid as a novel curing agent for epoxy in electronic materials [#227 in Nanotechnology and the Environment (I&EC)]. None Li Y, Wong CP Li Y, Wong CP. Amino acid as a novel curing agent for epoxy in electronic materials [#227 in Nanotechnology and the Environment (I&EC)]. Presented at the 231st ACS National Meeting, Atlanta, GA, March 26-30, 2006. R831489 (2006)
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Presentation Effects of surface chelating on corrosion control in electronic packaging [#198 in Advanced Materials for Microelectronic Packaging (I&EC)]. None Li Y, Wong CP Li Y, Wong CP. Effects of surface chelating on corrosion control in electronic packaging [#198 in Advanced Materials for Microelectronic Packaging (I&EC)]. Presented at the 231st ACS National Meeting, Atlanta, GA, March 26-30, 2006. R831489 (2006)
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Presentation High performance environmental friendly nano-composite for lead-free interconnect [#515 in Polymers in Microelectronics and Optoelectronics (PMSE)]. None Li Y, Wong CP Li Y, Wong CP. High performance environmental friendly nano-composite for lead-free interconnect [#515 in Polymers in Microelectronics and Optoelectronics (PMSE)]. Presented at the 231stACS National Meeting, Atlanta, GA, March 26-30, 2006. R831489 (2006)
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Presentation Improvement of electrical performance of anisotropically conductive adhesives (ACA). None Li Y, Moon K, Wong CP Li Y, Moon K, Wong CP. Improvement of electrical performance of anisotropically conductive adhesives (ACA). Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. R831489 (2005)
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Presentation Incorporation of self-assembly molecular wires into anisotropic conductive adhesive for high performance interconnection applications. None Zhang RW, Moon KS, Lin W, Jiang HJ, Wong CP Zhang RW, Moon KS, Lin W, Jiang HJ, Wong CP. Incorporation of self-assembly molecular wires into anisotropic conductive adhesive for high performance interconnection applications. Presented at the 10th Electronic Packaging Technology Conference, Singapore, December 9-12, 2008. R831489 (Final)
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Presentation Development of transparent and flexible electrically conductive adhesives for microelectronics applications. None Zhang RW, Wei W, Moon KS, Jiang HJ, Lin W, Wong CP Zhang RW, Wei W, Moon KS, Jiang HJ, Lin W, Wong CP. Development of transparent and flexible electrically conductive adhesives for microelectronics applications. Presented at the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, August 17-22, 2008. R831489 (Final)
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Presentation Electrically conductive adhesive with pi-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties. None Zhang R, Li Y, Moon K, Wong CP Zhang R, Li Y, Moon K, Wong CP. Electrically conductive adhesive with pi-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties. Presented at the IEEE 58th Electronic Components & Technology Conference, Orlando, FL, May 27, 2008. R831489 (2007)
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Proceedings Dynamics simulation of lead free solder for low temperature applications. None Dong H, Fan L, Moon K-S, Wong CP, et al

Dong H, Fan L, Moon K-S, Wong CP, et al. Dynamics simulation of lead free solder for low temperature applications. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005.

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Proceedings Role of self-assembled monolayer (SAM) on Ag nanoparticles for nanocomposite. None Jiang H, Moon K-S, Zhu L, Lu J, et al

Jiang H, Moon K-S, Zhu L, Lu J, et al. Role of self-assembled monolayer (SAM) on Ag nanoparticles for nanocomposite. In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005.

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Proceedings Synthesis of Ag-Cu nanoparticles for lead-free interconnect materials. None Jiang H, Moon K-S, Wong CP

Jiang H, Moon K-S, Wong CP. Synthesis of Ag-Cu nanoparticles for lead-free interconnect materials. In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005.

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Proceedings Ultra high conductivity of isotropic conductive adhesives. None Jiang H, Moon K, Li Y, Wong CP Jiang H, Moon K, Li Y, Wong CP. Ultra high conductivity of isotropic conductive adhesives. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 485-490. R831489 (2006)
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Proceedings Low temperature carbon nanotube film transfer via conductive adhesives 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS Jiang H, Zhu L, Moon K, Li Y, Wong C Jiang H, Zhu L, Moon K, Li Y, Wong C. Low temperature carbon nanotube film transfer via conductive adhesives. 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS 2007; R831489 (Final)
Proceedings Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects. None Jiang H, Yim MJ, Moon K-S, Wong CP Jiang H, Yim MJ, Moon K-S, Wong CP. Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1385-1389. R831489 (Final)
Proceedings Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications. None Jiang H, Moon K-S, Wong CP Jiang H, Moon K-S, Wong CP. Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1400-1404. R831489 (Final)
Proceedings Stabilizing contact resistance of adhesives on Sn surface by novel corrosion inhibitors. None Li Y, Moon K, Wong CP

Li Y, Moon K, Wong CP. Stabilizing contact resistance of adhesives on Sn surface by novel corrosion inhibitors. In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005.

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Proceedings Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes. None Li Y, Moon K, Wong CP

Li Y, Moon K, Wong CP. Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005.

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Proceedings High performance electrically conductive adhesives (ECAs) modified with novel aldehydes. None Li Y, Whitman A, Moon K, Wong CP

Li Y, Whitman A, Moon K, Wong CP. High performance electrically conductive adhesives (ECAs) modified with novel aldehydes. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005.

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Proceedings Improvement of electrical performance anisotropically conductive adhesives (ACA). None Li Y, Moon K, Wong CP

Li Y, Moon K, Wong CP. Improvement of electrical performance anisotropically conductive adhesives (ACA). In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005.

R831489 (2004)
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Proceedings Nano-Ag filled anisotropic conductive adhesives with self-assembled monolayer for high performance fine pitch. None Li Y, Wong CP

Li Y, Wong CP. Nano-Ag filled anisotropic conductive adhesives with self-assembled monolayer for high performance fine pitch. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005.

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Proceedings Effects of reducing agents on the electrical properties of electrically conductive adhesives. None Li Y, Moon K, Wong CP Li Y, Moon K, Wong CP. Effects of reducing agents on the electrical properties of electrically conductive adhesives. In: Proceedings of the 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, March 15-17, 2006, pp. 179-183. R831489 (2006)
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Proceedings Silver migration control in electrically conductive adhesives. None Li Y, Wong CP Li Y, Wong CP. Silver migration control in electrically conductive adhesives. In: Proceedings of the 8th Institute of Electrical and Electronics Engineers (IEEE) Components, Packaging and Manufacturing Technology (CPMT) International Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’06), Shanghai, China, June 27-30, 2006, pp. 206-212. R831489 (2006)
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Proceedings High performance nano-scale conductive films with low temperature sintering for fine pitch electronic interconnect PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION Li Y, Yim M, Moon K, Wong C Li Y, Yim M, Moon K, Wong C. High performance nano-scale conductive films with low temperature sintering for fine pitch electronic interconnect. PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION 2007;1-7 R831489 (Final)
Proceedings Nano-scale conductive films with low temperature sintering for high performance fine pitch interconnect. None Li Y, Yim MJ, Moon K, Wong CP Li Y, Yim MJ, Moon K, Wong CP. Nano-scale conductive films with low temperature sintering for high performance fine pitch interconnect. In: Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, NV, May 29-June 1, 2007, pp.1350-1355. R831489 (2007)
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Proceedings Novel monolayer-enhanced non-conductive film (NCF) for ultra-fine pitch high performance interconnect in lead-free electronics. None Li Y, Yim MJ, Wong CP Li Y, Yim MJ, Wong CP. Novel monolayer-enhanced non-conductive film (NCF) for ultra-fine pitch high performance interconnect in lead-free electronics. In:Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, NV, May 19-June 1, 2007, pp.1911-1915. R831489 (2007)
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Proceedings Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications. None Li Y, Yim MJ, Moon K, Zhang RW, Wong CP Li Y, Yim MJ, Moon K, Zhang RW, Wong CP. Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1272-1276. R831489 (Final)
Proceedings A novel environmentally friendly and biocompatible curing agent for lead-free electronics. None Li Y, Xiao F, Moon K, Wong CP Li Y, Xiao F, Moon K, Wong CP. A novel environmentally friendly and biocompatible curing agent for lead-free electronics. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1639-1644. R831489 (2006)
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Proceedings A novel non-migration nano-Ag conductive adhesive with enhanced electrical and thermal properties via self-assembled monolayers modification. None Li Y, Wong CP Li Y, Wong CP. A novel non-migration nano-Ag conductive adhesive with enhanced electrical and thermal properties via self-assembled monolayers modification. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 924-931. R831489 (2006)
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Proceedings High performance conductive adhesives for lead-free interconnects. None Li Y, Wong CP Li Y, Wong CP. High performance conductive adhesives for lead-free interconnects. In: Proceedings of the 2006 Materials Research Society (MRS) Fall Meeting [Symposium V, Advanced Electronics Packaging], Boston, MA, November 27-December 1, 2006. R831489 (2006)
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Proceedings Novel lead free nano-scale non-conductive adhesive (NCA) for ultra-fine pitch interconnect applications. None Li Y, Moon K, Wong CP Li Y, Moon K, Wong CP. Novel lead free nano-scale non-conductive adhesive (NCA) for ultra-fine pitch interconnect applications. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1239-1245. R831489 (2006)
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Proceedings Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications. None Li Y, Moon K, Wong CP Li Y, Moon K, Wong CP. Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications. In: Proceedings of the 2006 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 32-27. R831489 (2006)
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Proceedings Oxidation prevention and electrical property enhancements of copper-filled electrically conductive adhesives for electronic packaging and interconnection. None Yim MJ, Li Y, Moon KS, Wong CP Yim MJ, Li Y, Moon KS, Wong CP. Oxidation prevention and electrical property enhancements of copper-filled electrically conductive adhesives for electronic packaging and interconnection. In: Proceedings of the 57th Electronics Components and Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 82-88. R831489 (2007)
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Proceedings Advanced interconnect materials for ink-jet printing by low temperature sintering. None Zhang RW, Wong CP Zhang RW, Wong CP. Advanced interconnect materials for ink-jet printing by low temperature sintering. In: Proceedings of the IEEE 59th Electronic Components Technology Conference, San Diego, CA, May 26-29, 2009, pp. 150-154. R831489 (Final)
Proceedings Electrical properties of ACA joints assisted by conjugated molecular wires. None Zhang RW, Moon KS, Lin W, Wong CP Zhang RW, Moon K-S, Lin W, Wong CP. Electrical properties of ACA joints assisted by conjugated molecular wires. In: Proceedings of the IEEE 59th Electronic Components Technology Conference, San Deigo, CA, May 26-29, 2009, pp. 2034-2038. R831489 (Final)
Proceedings New electrically conductive adhesives (ECAs) for flexible interconnect applications. None Zhang RW, Duan YQ, Lin W, Moon KS, Wong CP Zhang RW, Duan YQ, Lin W, Moon K-S, Wong CP. New electrically conductive adhesives (ECAs) for flexible interconnect applications. In: Proceedings of the IEEE 59th Electronic Components Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1356-1360. R831489 (Final)
Proceedings Electrically conductive adhesive with π-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties. None Zhang R, Li Y, Yim MJ, Moon KS, Lu DD, Wong CP Zhang R, Li Y, Yim MJ, Moon KS, Lu DD, Wong CP. Electrically conductive adhesive with π-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30 2008, pp.1913-1918. R831489 (Final)

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