Dry Lithography: Environmentally Responsible Processes
for High Resolution Pattern Transfer and Elimination of Image Collapse using Positive
Tone Resists
EPA Grant Number: R829586
Title: Dry Lithography: Environmentally Responsible Processes
for High Resolution Pattern Transfer and Elimination of Image Collapse using Positive
Tone Resists
Investigators:
DeSimone, Joseph M.
Institution:
University of North Carolina at Chapel Hill
EPA Project Officer:
Richards, April
Project Period:
November 1, 2001 through
November 1, 2004
Project Amount:
$347,898
RFA:
Technology for a Sustainable Environment (2001)
RFA Text |
Recipients Lists
Research Category:
Sustainable and Healthy Communities
,
Nanotechnology
,
Pollution Prevention/Sustainable Development
Description:
With the award of the NSF Science and Technology Center for Environmentally
Responsible Processes and Solvents in 1999 (
http://www.nsfstc.unc.edu 
) and prior partnerships formed with
industrial members of the Kenan Center for the Utilization of Carbon Dioxide
(CO
2) in Manufacturing (
http://www2.ncsu.edu:8010/champagne/

), research endeavors by Joseph
DeSimone, the principal investigator of this proposal, have made significant
headway in replacing hazardous solvents and water with environmentally
responsible CO
2. In particular, this research has helped
establish the scientific and engineering principles necessary for the
commercialization of CO
2 in the manufacture of
Teflon
TM as well as professional garment care
(dry cleaning). It now seems feasible to drive this proposal and extend the
benefits of CO
2-based processes to the microelectronics
industry, taking advantage of the low surface tension and viscosity of CO
2 for applying and removing extremely thin films.
The focus of this proposed research is to utilize liquid and supercritical carbon dioxide to integrate the film deposition and removal processes in positive tone lithography with the chemistry to totally eliminate the use of solvents and water. This integrated approach based on CO2 will convert lithography from an inherently "wet" process to a "dry" process. Such a dry process would also eliminate image collapse, enable the "solvent free" coating of large area wafers, eliminate ion contamination associated with water usage during development, and ultimately allow lithographic processes to be designed for the first time into cluster tool approaches.
Approach:
The research includes environmentally friendly synthesis of advanced
photoresists, the in situ and ex situ characterization of the photoresist film
formation process, the physical and chemical characterization of the resists
relative to processing in CO
2, and the physical and
chemical characterization of the resists relative to resist performance.
Emphasis is on 193 and 157 nm resists.
Expected Results:
Much of what is learned about environmentally friendly synthesis, pattern
development avoiding collapse, and
in situ and
ex situ process
characterization will be useable for associated patterning technologies while
substantially and specifically advancing the practice of 157 nm lithography. The
team of researchers for this proposal is a multi-institutional,
multi-disciplinary team of scientists and engineers that are qualified to
provide sufficient process information to the microelectronics and photonics
industry for the rapid implementation of the CO
2 based
process for advanced technologies.
Publications and Presentations:
Publications have been submitted on this project:
View all 22 publications for this project
Supplemental Keywords:
photoacid generators, fluoropolymers, spin coating., RFA, Scientific Discipline, Sustainable Industry/Business, Chemical Engineering, Environmental Chemistry, Sustainable Environment, cleaner production/pollution prevention, Technology for Sustainable Environment, Economics and Business, Environmental Engineering, supercritical carbon dioxide (SCCO2) technology, in-process waste minimization, cleaner production, clean technologies, green design, high resolution pattern transfer, environmentally benign solvents, alternative materials, supercritical carbon dioxide, alternative solvents, engineering, solvent substitute, microelectronics, environmentally benign alternative, dry lithography, pollution prevention, green chemistry
Progress and Final Reports:
2002 Progress Report
2003 Progress Report
Final Report