Dry Lithography: Environmentally Responsible Processes for High Resolution Pattern Transfer and Elimination of Image Collapse using Positive Tone Resists
EPA Grant Number: R829586Title: Dry Lithography: Environmentally Responsible Processes for High Resolution Pattern Transfer and Elimination of Image Collapse using Positive Tone Resists
Investigators: DeSimone, Joseph M.
Institution: University of North Carolina at Chapel Hill
EPA Project Officer: Richards, April
Project Period: November 1, 2001 through November 1, 2004
Project Amount: $347,898
RFA: Technology for a Sustainable Environment (2001) RFA Text | Recipients Lists
Research Category: Sustainable and Healthy Communities , Nanotechnology , Pollution Prevention/Sustainable Development
Description:
With the award of the NSF Science and Technology Center for Environmentally Responsible Processes and Solvents in 1999 (http://www.nsfstc.unc.edu
) and prior partnerships formed with
industrial members of the Kenan Center for the Utilization of Carbon Dioxide
(CO2) in Manufacturing (http://www2.ncsu.edu:8010/champagne/
), research endeavors by Joseph
DeSimone, the principal investigator of this proposal, have made significant
headway in replacing hazardous solvents and water with environmentally
responsible CO2. In particular, this research has helped
establish the scientific and engineering principles necessary for the
commercialization of CO2 in the manufacture of
TeflonTM as well as professional garment care
(dry cleaning). It now seems feasible to drive this proposal and extend the
benefits of CO2-based processes to the microelectronics
industry, taking advantage of the low surface tension and viscosity of CO2 for applying and removing extremely thin films.
The focus of this proposed research is to utilize liquid and supercritical carbon dioxide to integrate the film deposition and removal processes in positive tone lithography with the chemistry to totally eliminate the use of solvents and water. This integrated approach based on CO2 will convert lithography from an inherently "wet" process to a "dry" process. Such a dry process would also eliminate image collapse, enable the "solvent free" coating of large area wafers, eliminate ion contamination associated with water usage during development, and ultimately allow lithographic processes to be designed for the first time into cluster tool approaches.