Research Grants/Fellowships/SBIR

Journal Publications Details for:

Fundamental Understanding and Performance Enhancement of Conductive Adhesive for Microelectronic Packaging Applications
Grant Number R831489
RFA: Technology for a Sustainable Environment (2003)

Journal Article (30)
Reference Type Citation Progress Report Year Document Sources
Journal Article Chiang H-W, Chung C-L, Chen L-C, Li Y, Wong CP, Fu S-L. Processing and shape effects on silver paste electrically conductive adhesives (ECAs). Journal of Adhesion Science and Technology 2005;19(7):565-578. R831489 (2005)
R831489 (Final)
Journal Article Dong H, Moon K-S, Wong CP. Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. Journal of Electronic Materials 2004;33(11):1326-1330. R831489 (2004)
R831489 (Final)
Journal Article Dong H, Zhang Z, Wong CP. Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. Journal of Adhesion Science and Technology 2005;19(2):87-94. R831489 (2004)
R831489 (2005)
R831489 (Final)
Journal Article Dong H, Moon K-S, Wong CP. Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. Journal of Electronic Materials 2005;34(1):40-45. R831489 (2004)
R831489 (2005)
R831489 (Final)
Journal Article Dong H, Meininger A, Jiang H, Moon K-S, Wong CP. Magnetic nanocomposite for potential ultrahigh frequency microelectronic application. Journal of Electronic Materials 2007;36(5):593-597. R831489 (2007)
Journal Article Dong H, Li Y, Yim MJ, Moon KS, Wong CP. Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. Applied Physics Letters 2007;90(9):092102. R831489 (2006)
R831489 (2007)
R831489 (Final)
Journal Article Jiang H, Moon K-S, Lu J, Wong CP. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. Journal of Electronic Materials 2005;34(11):1432-1439. R831489 (2005)
R831489 (Final)
Journal Article Jiang H, Moon K-S, Li Y, Wong CP. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chemistry of Materials 2006;18(13):2969-2973. R831489 (2006)
R831489 (Final)
Journal Article Jiang HJ, Moon KS, Zhang ZQ, Pothukuchi S, Wong CP. Variable frequency microwave synthesis of silver nanoparticles. Journal of Nanoparticle Research 2006;8(1):117-124. R831489 (2004)
R831489 (2005)
R831489 (Final)
Journal Article Jiang H, Moon K, Hua F, Wong CP. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. Chemistry of Materials 2007;19(18):4482-4485. R831489 (2007)
Journal Article Jiang H, Zhu L, Moon K-S, Wong CP. The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production. Carbon 2007;45(3):655-661. R831489 (2007)
Journal Article Jiang H, Moon K-S, Sun Y, Wong CP, Hua F, Pal T, Pal A. Tin/indium nanobundle formation from aggregation or growth of nanoparticles. Journal of Naonoparticle Research 2008;10(1):41-46. R831489 (Final)
Journal Article Li Y, Xiao F, Moon K-S, Wong CP. Novel curing agent for lead-free electronics: amino acid. Journal of Polymer Science Part A: Polymer Chemistry 2006;44(2):1020-1027. R831489 (2005)
R831489 (2006)
R831489 (Final)
Journal Article Li Y, Moon K-S, Wong CP. Materials science. Electronics without lead. Science 2005;308(5727):1419-1420. R831489 (2005)
R831489 (Final)
Journal Article Li Y, Moon K-S, Wong CP. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Journal of Electronic Materials 2005;34(3):266-271. R831489 (2005)
R831489 (Final)
Journal Article Li Y, Moon K-S, Wong CP. Monolayer-protected silver nano-particle-based anisotropic conductive adhesives:electrical and thermal properties. Journal of Electronic Materials 2005;34(12):1573-1578. R831489 (2005)
R831489 (Final)
Journal Article Li Y, Moon K-S, Wong CP. Reliability improvement of conductive adhesives on tin (Sn) surfaces. Journal of Adhesion Science and Technology 2005;19(16):1427-1444. R831489 (2005)
R831489 (Final)
Journal Article Li Y, Moon K-S, Whitman A, Wong CP. Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE Transactions on Components and Packaging Technologies 2006;29(4):758-763. R831489 (2006)
R831489 (Final)
Journal Article Li Y, Moon K-S, Wong CP. Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. Journal of Applied Polymer Science 2006;99(4):1665-1673. R831489 (2005)
R831489 (2006)
R831489 (Final)
Journal Article Li Y, Wong CP. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Materials Science and Engineering R: Reports 2006;51(1-3):1-35. R831489 (2005)
R831489 (2006)
R831489 (Final)
Journal Article Li Y, Moon K-S, Wong CP. Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Transactions on Components and Packaging Technologies 2006;29(1):173-178. R831489 (2005)
R831489 (2006)
R831489 (Final)
Journal Article Li Y, Wong CP. Monolayer protection for eletrochemical migration control in silver nanocomposite. Applied Physics Letters 2006;89(11):112112. R831489 (2006)
R831489 (Final)
Journal Article Li Y, Wong CP. High performance anisotropic conductive adhesives for lead-free interconnects. Soldering & Surface Mount Technology 2006;18(2)33-39. R831489 (2006)
R831489 (Final)
Journal Article Li Y, Xiao F, Wong CP. Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. Journal of Polymer Science Part A: Polymer Chemistry 2007;45(2):181-190. R831489 (2006)
R831489 (2007)
R831489 (Final)
Journal Article Li Y, Yim MJ, Wong CP. High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. Journal of Electronic Materials 2007;36(5):549-554. R831489 (2007)
Journal Article Li Y, Yim MJ, Moon KS, Wong CP. Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. IEEE Transactions on Advanced Packaging 2009;32(1):123-129. R831489 (Final)
Journal Article Moon K-S, Li Y, Xu JW, Wong CP. Lead-free interconnect technique by using variable frequency microwave. Journal of Electronic Materials 2005;34(7):1081-1088. R831489 (2004)
R831489 (2005)
R831489 (Final)
Journal Article Moon K-S, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP. Thermal behavior of silver nanoparticles for low-temperature interconnect applications. Journal of Electronic Materials 2005;34(2):168-175. R831489 (2005)
R831489 (Final)
Journal Article Yim MJ, Li Y, Moon KS, Wong CP. Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. Journal of Electronic Materials 2007;36(10):1341-1347. R831489 (2007)
Journal Article Yim MJ, Li Y, Moon K-S, Paik KW, Wong CP. Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. Journal of Adhesion Science and Technology 2008;22(14):1593-1630. R831489 (Final)