Research Grants/Fellowships/SBIR

Journal Publications Details for:

Removal of Photoresist and Post-Plasma Etch Sidewall Films Using Superciritical and Subcritical CO2 with Additives
Grant Number R829554
RFA: Technology for a Sustainable Environment (2001)

Journal Article (7)
Reference Type Citation Progress Report Year Document Sources
Journal Article Levitin G, Myneni S, Hess DW. Reactions between CO2 and tetramethylammonium hydroxide in cleaning solutions. Electrochemical and Solid State Letters 2003;6(8):G101-G104. R829554 (2002)
R829554 (2003)
R829554 (Final)
not available
Journal Article Levitin G, Bush D, Eckert CA, Hess DW. Phase behavior and modeling of CO2/methanol/tetramethylammonium bicarbonate and O2/methanol/tetramethylammonium bicarbonate/water mixtures at high pressures. Journal of Chemical Engineering & Data 2004;49(3):599-606. R829554 (2003)
R829554 (Final)
not available
Journal Article Levitin G, Myneni S, Hess DW. Post plasma etch residue removal using CO2-TMAHCO(3) mixtures: Comparison of single-phase and two-phase mixtures. Journal of the Electrochemical Society 2004;151(6):G380-G386 R829554 (2002)
R829554 (2003)
R829554 (Final)
not available
Journal Article Levitin G, Hess DW. Ionic conductivity of elevated pressure TMAHCO(3)/MeOH/CO2 mixtures. Electrochemical and Solid State Letters 2005;8(1):G23-G26 R829554 (Final)
not available
Journal Article Myneni S, Hess DW. Post-plasma-etch residue removal using CO2-based fluids. Journal of the Electrochemical Society 2003;150(12):G744-G750 R829554 (Final)
not available
Journal Article

Myneni S, Peng H-G, Gidley DW, Hess DW. Compatibility of High Pressure Cleaning Mixtures with a Porous Low Dielectric Constant Film: A positronium Annihilation Lifetime Spectroscopic Study. Journal of Vacuum Science and Technology B 2005;.23(4): 1463.

R829554 (Final)
not available
Journal Article Myneni S, Hess DW. Post plasma etch residue removal using CO2-based mixtures: Mechanistic considerations. Journal of the Electrochemical Society 2005;152(10) R829554 (Final)
not available